SPK10-0.006-00-11.512

Bergquist Company
951-SPK1000060011512
SPK10-0.006-00-11.512

Herst.:

Beschreibung:
Thermische Schnittstellenprodukte Insulator, 11.5"x12" Sheet, 0.006" Thickness, SIL PAD TSPK1300/K-10

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Auf Lager: 567

Lagerbestand:
567 sofort lieferbar
Lieferzeit ab Hersteller:
8 Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.
Minimum: 1   Vielfache: 1
Stückpreis:
CHF -.--
Erw. Preis:
CHF -.--
Vorauss. Zolltarif:

Preis (CHF)

Menge Stückpreis
Erw. Preis
CHF 26.33 CHF 26.33
CHF 23.31 CHF 233.10
CHF 22.39 CHF 559.75

Produktattribut Attributwert Attribut auswählen
Bergquist Company
Produktkategorie: Thermische Schnittstellenprodukte
RoHS:  
Thermally Conductive Insulators
Thermal Pad
Non-standard
Silicone Elastomer
1.3 W/m-K
6 kVAC
Beige
- 60 C
+ 180 C
304.8 mm
292.1 mm
0.006 in
35 MPa
UL 94 VTM-0
K-10 / TSP K1300
Marke: Bergquist Company
Bestimmt für: Replacing Ceramic Insulators
Produkt-Typ: Thermal Interface Products
Verpackung ab Werk: 1
Unterkategorie: Thermal Management
Handelsname: Sil-Pad
Artikel # Aliases: L12INW12INH0.006 BG80000 SPK10-0.006-00-11.5X12 L12INW12INH0D0 2167642
Gewicht pro Stück: 21.772 g
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Ausgewählte Attribute: 0

Konformitätscodes
USHTS:
3919905060
KRHTS:
3919900000
MXHTS:
3919909900
ECCN:
EAR99
Ursprungsklassifikationen
Ursprungsland:
Vereinigte Staaten
Herstellungsland:
Nicht lieferbar
Land der Verbreitung:
Nicht lieferbar
Zum Zeitpunkt der Lieferung kann sich das Land ändern.

GAP PAD® Thermally Conductive Materials

Bergquist GAP PAD® Thermally Conductive Materials meet the electronic industry’s growing need for interface materials with greater conformability, higher thermal performance, and easier application. The extensive GAP PAD family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps, and rough surface textures are present. The GAP PAD Thermally Conductive Materials are available in a variety of thicknesses and hardnesses, a range of thermal conductivity ratings, in sheets or die-cut parts, and with fiberglass/rubber carrier or non-reinforced versions. GAP PAD products are well suited to a wide variety of electronic, automotive, medical, and aerospace/defense applications.

EV Charging Solutions

Bergquist Company Electric Vehicle (EV) Charging Solutions feature products designed to provide safe charging while protecting EV battery packs from thermal and/or electrical events. These thermal management materials effectively dissipate heat from high voltage, high power density EV charging systems while gasketing, potting, and conformal coating solutions protect high-value electronics in outdoor environments. Bergquist gasketing and protection solutions safeguard electronics against elemental exposure and damaging contaminants, while thermal interface materials improve power conversion efficiency and reliability. Potting formulations deliver toughness through encapsulation and protection of connectors, and adhesives provide manufacturing productivity improvements. Together, these Bergquist solutions help deliver EV charging dependability.

Green Energy

Bergquist Company Green Energy products are designed to improve alternative energy conversion and storage, boosting the efficiency of solar power networks. Harnessing power from the sun and other energy sources advances sustainability efforts while increasing the amount and availability of global power, even in places that have limited infrastructure. This green energy product lineup from Bergquist features robust products ideal for solar power inverters, solar power optimizers, industrial battery chargers, and lithium-ion batteries.

Industrial Automation

Bergquist Industrial Automation provides advanced materials that are crucial in groundbreaking industrial automation technologies and the advancement of Industry 4.0. Industrial processes are changing, and artificial intelligence (AI), machine learning, robotics, and the Industrial Internet of Things (IIoT) are moving mainstream. These developments make it critical to have the right material and components to dissipate heat, protect electronics in harsh environments, secure components, and deliver electrical integrity.

Thermal SIL PAD® Materials

Bergquist Company Thermal SIL PAD® Materials are electrically and non-electrically insulating silicone thermal interface materials. These materials minimize thermal resistance from the external package of a power semiconductor to the heat sink. This is achieved by isolating the semiconductor electrically from the heat sink and providing sufficient dielectric strength to withstand high voltage. The Bergquist SIL PAD materials are made of conformable fiberglass and silicone rubber, which provides a more versatile material than mica or ceramics and grease. These materials are designed to be clean, grease-free, and flexible. The SIL PAD materials feature reinforcements to resist cut-through, a wide range of thermal conductivities and dielectric strengths, and excellent thermal performance with minimized thermal resistance. These cost-effective materials are resistant to electrical shorting and enhance performance for high-heat compacted assemblies.

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