140-510-415-100

EDAC
587-140-510-415-100
140-510-415-100

Herst.:

Beschreibung:
Sockel & Kabelgehäuse 140 Series Wire to Board in-line 2.0mm pitch connector with 10 P.C. board through hole contacts, side entry

ECAD Model:
Den kostenlosen Library Loader herunterladen, um diese Datei für Ihr ECAD Tool zu konvertieren. Weitere Infos zu ECAD-Modell.

Auf Lager: 963

Lagerbestand:
963 sofort lieferbar
Minimum: 1   Vielfache: 1
Stückpreis:
CHF -.--
Erw. Preis:
CHF -.--
Vorauss. Zolltarif:

Preis (CHF)

Menge Stückpreis
Erw. Preis
CHF 0.333 CHF 0.33
CHF 0.296 CHF 2.96
CHF 0.263 CHF 6.58
CHF 0.244 CHF 24.40
CHF 0.204 CHF 51.00
CHF 0.165 CHF 165.00
CHF 0.159 CHF 397.50
CHF 0.154 CHF 1'540.00
CHF 0.15 CHF 3'000.00

Produktattribut Attributwert Attribut auswählen
EDAC
Produktkategorie: Sockel & Kabelgehäuse
RoHS:  
Headers
Shrouded
10 Position
2 mm (0.079 in)
1 Row
PCB Mount
Solder Pin
Right Angle
Pin (Male)
Tin
140
Wire-to-Board
- 40 C
+ 105 C
Marke: EDAC
Kontaktmaterial: Brass
Nennstrom: 2 A
Entflammbarkeitseinstufung: UL 94 V-0
Gehäusefarbe: Natural
Gehäusematerial: Polyamide (PA)
Isolierungswiderstand: 1 GOhms
Produkt-Typ: Headers & Wire Housings
Verpackung ab Werk: 1
Unterkategorie: Headers & Wire Housings
Nennspannung: 100 V
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USHTS:
8536694040
ECCN:
EAR99

140 Series 2mm Wire-to-Board Connectors

EDAC 140 Series 2mm Wire-to-Board Connectors are available in various positions with top-entry or side-entry configurations. Additional variations include right-angle, vertical, and SMT or through-hole mounted to the PCB. These inline connectors are designed for the high-density connection of internal wires to PCBs with a thickness of 1.2mm to 1.6mm. They have a 2A current rating and a low-profile insulator body with a 6.1mm height and 4.70mm width. They operate in a -40°C to +105°C temperature range. EDAC 140 Series 2mm Wire-to-Board Connectors are compatible with leading industry connectors as drop-in replacements and ideal for use in wire harness applications.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.