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566-004-000-810

Name: EDAC 566-004-000-810
Brand: EDAC
SKU: 587-566-004-000-810
Price: 4.12 CHF
Availability: InStock

Bilder dienen lediglich der Veranschaulichung und sind nicht Originalgetreu
Siehe Produktspezifikationen

Mouser-Nr.:

587-566-004-000-810

Herst.- Nr.:

566-004-000-810

Herst.:

EDAC

Beschreibung:

Pin & Socket-Steckverbindungen 566 Series Wire to Wire / Wire to Board 2.0mm pitch connector with 4 contact spaces, female, black, Wire Insulation oe1.00 to oe1.25

Datenblatt:

566-004-000-810 Datenblatt (PDF)

ECAD Model:

Den kostenlosen Library Loader herunterladen, um diese Datei für Ihr ECAD Tool zu konvertieren. Weitere Infos zu ECAD-Modell.

Mehr über

Weitere Informationen zu EDAC 566-004-000-810

Auf Lager: 232

Lagerbestand:: 232 sofort lieferbar

Ein unerwarteter Fehler ist aufgetreten. Bitte versuchen Sie es später noch einmal.
Lieferzeit ab Hersteller:: 18 Wochen Geschätzte Produktionszeit des Werks für Mengen, die größer als angezeigt sind.

Menge eingeben:

Minimum: 1 Vielfache: 1

Stückpreis:

CHF -.--

Erw. Preis:

CHF -.--

Vorauss. Zolltarif:

Preis (CHF)

Menge	Stückpreis	Erw. Preis
	CHF 4.12	CHF 4.12
	CHF 3.93	CHF 39.30
	CHF 3.76	CHF 376.00
	CHF 2.89	CHF 722.50
	CHF 2.80	CHF 1’400.00
	CHF 2.39	CHF 2’390.00
	CHF 2.22	CHF 5’550.00

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Produktattribut	Attributwert	Attribut auswählen
Hersteller:	EDAC
Produktkategorie:	Pin & Socket-Steckverbindungen
RoHS:
Produkt:	Plug Housings
Anzahl der Positionen:	4 Position
Anzahl der Zeilen:	1 Row
Abstand:	2 mm
Montage:	Crimp
Montageart:	Free Hanging
Gehäusematerial:	Polybutylene Terephthalate (PBT)
Nennspannung:	250 V
Serie:	566
Marke:	EDAC
Produkt-Typ:	Pin & Socket Connectors
Verpackung ab Werk:	250
Unterkategorie:	Pin & Socket Connectors
Gewicht pro Stück:	1 g

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Ausgewählte Attribute: 0

Dokument filtern:

CNHTS:: 8538900000
CAHTS:: 8538903900
USHTS:: 8538908180
JPHTS:: 853890000
TARIC:: 8538909999
BRHTS:: 85389090
ECCN:: EAR99

Medical Interconnect Solutions

EDAC offers a comprehensive range of connectors and cable assemblies designed for medical applications. Featured products include card edge connectors for signal and power delivery in blood analyzers, header connectors for facilitating multi-board solutions, in-line connectors for ensuring reliable wire-to-wire and wire-to-board connections, and rugged in-line, D-Sub, USB, and HDMI connectors for IP-rated protection. The IP-rated connectors are EMI-shielded and prevent dust, debris, and moisture ingress, which enhances patient care and diagnostic accuracy while meeting stringent regulatory standards. These EDAC connectors and cable assemblies are ideal medical interconnect solutions, such as ambulances, medical rooms, ventilators, and CPAP machines.

Agricultural Technology Interconnect Solutions

EDAC Agricultural Technology (Agritech) Interconnect products offer reliable and durable connector solutions that can withstand harsh agricultural environments, including moisture, dust, and UV radiation exposure. These ruggedized solutions, such as IP67-rated connectors like Inline, D-sub, USB, and HDMI, ensure stable connections for sensor modules and heavy machinery. Increased efficiency, productivity, and yield in agricultural operations are achieved due to this reliability and durability. EDAC Agritech Interconnect Solutions support integrating advanced technologies like IoT and machine learning.

Industrial Interconnect Solutions

EDAC Industrial Interconnect Solutions offer various connectors with robust features for demanding industrial automation environments. Many IP67-rated waterproof connectors provide E-Seal technology for comprehensive back-end sealing and guarding against dust, humidity, and water exposure. EDAC Industrial Interconnect Solutions ensure reliable connection and durability amidst mechanical stresses, environmental challenges, and electrical disturbances. The connectors optimize space utilization in densely packed industrial installations and applications, including manufacturing robotics, pharmaceutical manufacturing, food processing, and conveyor systems.

Communication Interconnect Solutions

EDAC Communication Interconnect Solutions are robust and high-performance solutions that meet the demands of data center and telecom infrastructure. As networks scale to support cloud computing and 5G rollout, the high-speed connectivity solutions ensure uptime, minimize signal loss, and withstand controlled and outdoor environments. The EDAC connectivity solutions include high-density board-level connectors, ruggedized power, and I/O interfaces. These solutions are designed for durability with high mating cycles and are suitable for modular upgrades and maintenance. The connectivity solutions are available in IP-rated options for telecom towers and outdoor network gear. These connectivity solutions are ideal for data centers, communication nodes, phone systems, and smart building IoT applications.