Alle Ergebnisse (1’095)

Computer-On-Module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Module - COM JUMPtec COMe-bBD7R E2 D-1539 10G-KR

Entwicklungsplatinen & -kits - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0

Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Computer-On-Module - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Entwicklungsplatinen & -kits - x86 COMe Eval Carrier T7

Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).

CPU- und Chip-Kühler COMe Active Uni Cooler (w/o HSP)

Wärmeableitungen HSP COMe-mAL10 E2 slim thread

Wärmeableitungen Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm

Computer-On-Module - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.