DIP300 SOIC Adapters

Chip Quik DIP300 Single Outline Integrated Circuits (SOIC) feature wide- and narrow-bodied adapters with a 10-28 dual in-line package (DIP) range. The SOICs offer an FR-4 UL 94V-0 PCB, a PA6T plastic body, and a gold-plated pin construction within its 1.27mm pitch. The Chip Quik DIP300 SOICs provide a ≤20mΩ contact resistance per contact and ≥500MΩ insulation resistance at 100V. The SOICs operate within a -40°C to +130°C temperature range and feature a 300VAC withstanding voltage per minute.

Ergebnisse: 20
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Anzahl der Positionen
Anzahl der Zeilen
Abstand
Montage
Kontaktüberzug
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Chip Quik IC u. Komponentensockel DIP-16 (0.3" width, 0.1" pitch) to SOIC-16 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
33Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 16 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-24 (0.3" width, 0.1" pitch) to SOIC-24 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
24Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 24 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-24 (0.3" width, 0.1" pitch) to SOIC-24 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 24 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-28 (0.3" width, 0.1" pitch) to SOIC-28 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
16Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 28 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-14 (0.3" width, 0.1" pitch) to SOIC-14 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 14 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-16 (0.3" width, 0.1" pitch) to SOIC-16 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
10Auf Lager
10erwartet ab 01.06.2026
Min.: 1
Mult.: 1

DIP Sockets 16 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-10 (0.3" width, 0.1" pitch) to SOIC-10 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 10 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-10 (0.3" width, 0.1" pitch) to SOIC-10 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
20Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 10 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-14 (0.3" width, 0.1" pitch) to SOIC-14 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
18Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 14 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-20 (0.3" width, 0.1" pitch) to SOIC-20 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
17Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 20 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-28 (0.3" width, 0.1" pitch) to SOIC-28 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
12Auf Lager
Min.: 1
Mult.: 1

DIP Sockets 28 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-18 (0.3" width, 0.1" pitch) to SOIC-18 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
2erwartet ab 29.06.2026
Min.: 1
Mult.: 1

DIP Sockets 18 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-20 (0.3" width, 0.1" pitch) to SOIC-20 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
3erwartet ab 08.06.2026
Min.: 1
Mult.: 1

DIP Sockets 20 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-12 (0.3" width, 0.1" pitch) to SOIC-12 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 12 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-12 (0.3" width, 0.1" pitch) to SOIC-12 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 12 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-18 (0.3" width, 0.1" pitch) to SOIC-18 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 18 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-22 (0.3" width, 0.1" pitch) to SOIC-22 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 22 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-22 (0.3" width, 0.1" pitch) to SOIC-22 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 22 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-26 (0.3" width, 0.1" pitch) to SOIC-26 Narrow (1.27mm pitch, 150/200 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 26 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C
Chip Quik IC u. Komponentensockel DIP-26 (0.3" width, 0.1" pitch) to SOIC-26 Wide (1.27mm pitch, 300 mil body) Adapter
Datenblatt
Nicht auf Lager
Min.: 1
Mult.: 1

DIP Sockets 26 Position 2 Row 1.27 mm Through Hole Gold - 40 C + 130 C