Q Strip™ QTE High-Speed Ground Plane Headers

Samtec Q Strip™ QTE High-Speed Ground Plane Headers are an Extended Life Product (E.L.P.™) and offer 5mm to 30mm stack heights and up to 200 positions. The QTE series features a 225VAC voltage rating, a 2A per pin current rating, and a 28+Gbps solution. These headers have an integral metal plane that is useful for power or ground. Samtec Q Strip™ QTE High-Speed Ground Plane Headers are compatible with UMPT/UMPS for flexible two-piece power/signal solutions.

Ergebnisse: 788
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Stackhöhe Nennstrom Nennspannung Maximale Datenrate Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Serie Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 4 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 150
Mult.: 150
Rolle: 150

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 150
Mult.: 150
Rolle: 150

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 11 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 1
Mult.: 1
Rolle: 100
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel, Cut Tape
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 4 Wochen
Min.: 1
Mult.: 1
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 100
Mult.: 100
Rolle: 100

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 6 Wochen
Min.: 100
Mult.: 100
Rolle: 100
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 16 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 19 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 19 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 1
Mult.: 1
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 19 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 1
Mult.: 1
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 19 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 22 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Vertical 22 mm 2 A 225 VAC 28 Gbps - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 22 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 4 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 25 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 3 Wochen
Min.: 1
Mult.: 1
Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 25 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder Q Strip High-Speed Ground Plane Header Nicht-auf-Lager-Vorlaufzeit 4 Wochen
Min.: 1
Mult.: 1

Headers 28 Position 0.8 mm (0.031 in) 2 Row Solder Straight 25 mm 2 A 225 VAC - 55 C + 125 C Gold Phosphor Bronze Liquid Crystal Polymer (LCP) QTE Tube