AMPMODU MOD II Connectors

TE Connectivity's (TE) AMPMODU MOD II Connectors feature a 0.100" (2.54mm) pitch with shrouded and unshrouded headers in surface-mount and through-hole configurations. AMPMODU MOD II headers are available in single- or double-row configurations with 0.025" square posts and a current rating of 3A max per contact. TE AMPMODU MOD II headers are mateable with receptacle housings from the AMPMODU MOD IV and AMPMODU MTE product lines.

Ergebnisse: 2’121
Auswählen Bild Teile-Nr.
 Herst.
Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Produkt
Typ
Anzahl der Positionen
Abstand
Anzahl der Zeilen
Zeilenabstand
Montageart
Montage
Montagewinkel
Kontakt-Gender
Kontaktüberzug
Länge der Mating-Position
Länge des Abschlussstiftes
Serie
Handelsname
Anwendung
Drahtstärke
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Verpackung
TE Connectivity Sockel & Kabelgehäuse 3P SINGLE ROW
Datenblatt
1’972Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 5.8 mm (0.228 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 3P AMPMODU II STIFT LEI
Datenblatt
421Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 3 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 5.8 mm (0.228 in) 2.5 mm (0.098 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 4P AMPMODU II STIFT LEI
Datenblatt
103Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 4 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 5.8 mm (0.228 in) 2.5 mm (0.098 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 5P AMPMODU II STIFT LEI
Datenblatt
991Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 5 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 8 mm (0.315 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1X02 POS R/A AU
Datenblatt
4’196Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Gold 5.8 mm (0.228 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X03 POS VERT AU
Datenblatt
332Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 2.79 mm (0.11 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X04 POS VERT AU
Datenblatt
1’593Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 2.79 mm (0.11 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X06 POS VERT AU
Datenblatt
124Auf Lager
6’000erwartet ab 25.05.2026
Min.: 1
Mult.: 1

Headers Breakaway 12 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 2.79 mm (0.11 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 8P MOD2 STIFT LEI
Datenblatt
62Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 8 mm (0.315 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X04 POS VERT TIN
Datenblatt
9Auf Lager
7’200erwartet ab 25.05.2026
Min.: 1
Mult.: 1

Headers Breakaway 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.7 mm (0.264 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X07 POS VERT TIN
Datenblatt
1’563Auf Lager
6’000erwartet ab 18.05.2026
Min.: 1
Mult.: 1

Headers Breakaway 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 6.7 mm (0.264 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C
TE Connectivity Sockel & Kabelgehäuse AMP MODU II PIN HEAD
Datenblatt
14Auf Lager
72’000erwartet ab 06.04.2026
Min.: 1
Mult.: 1

Headers Breakaway 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 6.7 mm (0.264 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C
TE Connectivity Sockel & Kabelgehäuse 1X06 POS VERT TIN
Datenblatt
736Auf Lager
12’000erwartet ab 30.03.2026
Min.: 1
Mult.: 1

Headers Breakaway 6 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 6.7 mm (0.264 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2P SINGLE ROW
Datenblatt
6’134Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 2 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 5.8 mm (0.228 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 6P SINGLE ROW
Datenblatt
702Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 6 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Tin 5.8 mm (0.228 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 2X05 POS VERT TIN
Datenblatt
1’594Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Tin 5.8 mm (0.228 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C
TE Connectivity Sockel & Kabelgehäuse 2X08 POS VERT TIN
Datenblatt
1’757Auf Lager
Min.: 1
Mult.: 1

Headers Breakaway 8 Position 2.54 mm (0.1 in) 1 Row Through Hole Solder Pin Right Angle Pin (Male) Tin 6.7 mm (0.264 in) 3.2 mm (0.126 in) AMPMODU MOD II AMPMODU Board-to-Board - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse UNSHRD VERT DUAL 10
Datenblatt
19Auf Lager
3’200erwartet ab 22.04.2026
Min.: 1
Mult.: 1

Headers Unshrouded 10 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse UNSHRD VERT DUAL 16
Datenblatt
103Auf Lager
Min.: 1
Mult.: 1

Headers Unshrouded 16 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU - 65 C + 105 C Bulk
TE Connectivity Sockel & Kabelgehäuse 1P HDR .100 UNSHROUDED
Datenblatt
1’442Auf Lager
Min.: 1
Mult.: 1

Headers Unshrouded 1 Position 2.54 mm (0.1 in) 1 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse UNSHRD VERT SNGL 2
Datenblatt
576Auf Lager
20’000erwartet ab 13.07.2026
Min.: 1
Mult.: 1

Headers Unshrouded 2 Position 2.54 mm (0.1 in) 1 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse 06 MODII HDR SRST UN
Datenblatt
59Auf Lager
2’000erwartet ab 06.04.2026
Min.: 1
Mult.: 1

Headers Unshrouded 6 Position 3.81 mm (0.15 in) 1 Row Through Hole Solder Pin Straight Pin (Male) Gold 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse UNSHRD VERT DUAL 14
Datenblatt
98Auf Lager
2’000erwartet ab 29.06.2026
Min.: 1
Mult.: 1

Headers Unshrouded 14 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Straight Pin (Male) Gold 8.08 mm (0.318 in) 3.18 mm (0.125 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Bulk
TE Connectivity Sockel & Kabelgehäuse UNSHRD R.A. DUAL 6P
Datenblatt
883Auf Lager
Min.: 1
Mult.: 1

Headers Unshrouded 6 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Solder Pin Right Angle Pin (Male) Gold 8.08 mm (0.318 in) 2.79 mm (0.11 in) AMPMODU MOD II AMPMODU - 65 C + 105 C Tray
TE Connectivity Sockel & Kabelgehäuse UNSHRD R.A. DUAL 8P
Datenblatt
97Auf Lager
1’200erwartet ab 15.06.2026
Min.: 1
Mult.: 1

Headers Unshrouded 8 Position 2.54 mm (0.1 in) 2 Row 2.54 mm (0.1 in) Through Hole Solder Pin Right Angle Pin (Male) Gold 8.08 mm (0.318 in) 2.79 mm (0.11 in) AMPMODU MOD II AMPMODU Board-to-Board - 55 C + 125 C Tray