|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-06-2-K-TR
- Samtec
-
650:
CHF 5.26
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF10035L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 5.26
|
|
|
CHF 5.13
|
|
Min.: 650
Mult.: 650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-S-04-1-K-TR
- Samtec
-
650:
CHF 4.65
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF10035S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
CHF 4.65
|
|
|
CHF 4.54
|
|
Min.: 650
Mult.: 650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-S-04-2-K-TR
- Samtec
-
650:
CHF 4.65
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAF10035S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
|
CHF 4.65
|
|
|
CHF 4.54
|
|
Min.: 650
Mult.: 650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-S-06-2-K-TR
- Samtec
-
650:
CHF 5.53
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF10035S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 5.53
|
|
|
CHF 5.39
|
|
Min.: 650
Mult.: 650
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-04-1-K-TR
- Samtec
-
550:
CHF 5.99
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF20030L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
CHF 5.99
|
|
|
CHF 5.84
|
|
Min.: 550
Mult.: 550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-06-1-K-TR
- Samtec
-
550:
CHF 6.11
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF20030L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 550
Mult.: 550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-2-K-TR
- Samtec
-
350:
CHF 9.10
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF20030L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
CHF 9.10
|
|
|
CHF 8.86
|
|
Min.: 350
Mult.: 350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-S-04-2-K-TR
- Samtec
-
550:
CHF 6.29
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF20030S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
CHF 6.29
|
|
|
CHF 6.13
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-S-06-2-K-TR
- Samtec
-
550:
CHF 6.42
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF20030S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-S-08-2-K-TR
- Samtec
-
350:
CHF 9.54
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF20030S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
CHF 9.54
|
|
|
CHF 9.31
|
|
Min.: 350
Mult.: 350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-L-06-1-K-TR
- Samtec
-
500:
CHF 6.22
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAF20035L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-L-06-2-K-TR
- Samtec
-
500:
CHF 6.22
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAF20035L062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-L-08-2-K-TR
- Samtec
-
325:
CHF 9.27
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF20035L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
CHF 9.27
|
|
|
CHF 9.03
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-04-1-K-TR
- Samtec
-
500:
CHF 5.50
-
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
Mouser-Teilenr.
200-LPAF20035S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 5 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-04-2-K-TR
- Samtec
-
500:
CHF 5.50
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF20035S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-06-1-K-TR
- Samtec
-
500:
CHF 6.54
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAF20035S061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-06-2-K-TR
- Samtec
-
500:
CHF 6.54
-
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
Mouser-Teilenr.
200-LPAF20035S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 10 Wochen
|
|
Min.: 500
Mult.: 500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.5-S-08-2-K-TR
- Samtec
-
325:
CHF 9.75
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAF20035S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
|
CHF 9.75
|
|
|
CHF 9.50
|
|
Min.: 325
Mult.: 325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-L-06-1-K-TR
- Samtec
-
550:
CHF 7.26
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF30030L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 550
Mult.: 550
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-L-08-1-K-TR
- Samtec
-
350:
CHF 10.82
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30030L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 10.82
|
|
|
CHF 10.56
|
|
Min.: 350
Mult.: 350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-04-2-K-TR
- Samtec
-
550:
CHF 6.42
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30030S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-06-2-K-TR
- Samtec
-
550:
CHF 7.63
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30030S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 550
Mult.: 550
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-08-1-K-TR
- Samtec
-
350:
CHF 11.36
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30030S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 11.36
|
|
|
CHF 11.07
|
|
Min.: 350
Mult.: 350
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.0-S-08-2-K-TR
- Samtec
-
350:
CHF 11.36
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30030S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 11.36
|
|
|
CHF 11.07
|
|
Min.: 350
Mult.: 350
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-30-03.5-L-04-1-K-TR
- Samtec
-
500:
CHF 6.22
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAF30035L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
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Nicht-auf-Lager-Vorlaufzeit 11 Wochen
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Min.: 500
Mult.: 500
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Headers
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1.27 mm (0.05 in)
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Solder
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Straight
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2.2 A
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250 V
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- 55 C
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+ 125 C
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Gold
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Copper Alloy
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Liquid Crystal Polymer (LCP)
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LPAF
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Reel
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