Each IC u. Komponentensockel

Ergebnisse: 121
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Anzahl der Zeilen Typ Abstand Montage Kontaktüberzug Zeilenabstand Minimale Betriebstemperatur Maximale Betriebstemperatur Verpackung
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .4MM,56P EVEN ROW,W/THRML PI 11Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 56 Position QFN Socket 0.4 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,64P EVEN ROW,W/THRML PI 41Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 64 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel POWER IN-LINE SOCKET 3contact, 1 piece 110Auf Lager
130erwartet ab 27.07.2026
Min.: 1
Mult.: 1

Transistor Sockets 3 Position 2 Row Discrete Power In-Line 5.94 mm Solder Gold 8.23 mm - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel .1" INLINE ZIP STRIP Socket 10 Contct Qt 57Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 10 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,24P EVEN ROW,W/THRML PI 21Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 24 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.100" DIP SOCKET 48 Contact Qty. 45Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 48 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel 8P DUAL WIPE DIPSKT 5’895Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 8P DUAL WIPE DIPSKT 23’176Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 8 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 14P DUAL WIPE DIPSKT 11’123Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 14 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 16P DUAL WIPE DIPSKT 5’450Auf Lager
10’000erwartet ab 07.09.2026
Min.: 1
Mult.: 1

DIP / SIP Sockets 16 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 18P DUAL WIPE DIPSKT 8’754Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 18 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 24P DUAL WIPE DIPSKT 4’197Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 24 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 7.62 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 28P DUAL WIPE DIPSKT 4’716Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 28 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 32P DUAL WIPE DIPSKT 2’393Auf Lager
Min.: 1
Mult.: 1

DIP / SIP Sockets 32 Position 2 Row Open Frame 2.54 mm Solder Tail Tin 15.24 mm - 25 C + 85 C Each
3M Electronic Solutions Division IC u. Komponentensockel 52P PLCC SOCKET SMT W/LOCATION POSTS 28Auf Lager
1’104erwartet ab 20.07.2026
Min.: 1
Mult.: 1

PLCC Sockets 52 Position 4 Row Chip Carrier 1.27 mm Solder Pad Tin 15.24 mm - 40 C + 105 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 8 Leads 48Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 8 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 14 Contact Qty. 19Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 14 Position 2.54 mm Through Hole Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 14 Leads 1Auf Lager
20erwartet ab 03.09.2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 14 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel RECPT FOR DIP SOCKET 16 Contact Qty. 19Auf Lager
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 16 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 7.62 mm - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel Textool QFN .5MM,16P EVEN ROW,W/THRML PI 6Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position QFN Socket 0.5 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 16 Leads 7Auf Lager
30erwartet ab 10.08.2026
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 16 Leads 26Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 16 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel .1" INLINE ZIP STRIP Socket 20 Contct Qty 2Auf Lager
40Auf Bestellung
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 20 Position 1 Row SIP Socket 2.54 mm Solder Pin Gold - 55 C + 125 C Each
3M Electronic Solutions Division IC u. Komponentensockel BURN-IN SOIC SOCKET 20 Leads 18Auf Lager
Min.: 1
Mult.: 1

Test & Burn-In Sockets 20 Position SOIC 5.08 mm Solder Pin Gold - 55 C + 150 C Each
3M Electronic Solutions Division IC u. Komponentensockel 0.100" DIP SOCKET 24 Contact Qty. 27Auf Lager
40erwartet ab 18.09.2026
Min.: 1
Mult.: 1

Zero Insertion Force (ZIF) Sockets 24 Position 2 Row DIP Socket 2.54 mm Solder Pin Gold 15.24 mm - 55 C + 125 C Each