ARM Cortex M33 Kern Bluetooth-Module – 802.15.1

Ergebnisse: 45
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Serie Protokoll Klasse Schnittstellen-Typ Ausgangsleistung Übertragungsgeschwindigkeit Empfängerempfindlichkeit Frequenz Versorgungsspannung - Min. Versorgungsspannung - Max. Minimale Betriebstemperatur Maximale Betriebstemperatur Verpackung
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna/RF Pin, 24 GPIO, 105C 7'775Auf Lager
Min.: 1
Mult.: 1
Rolle: 2'500

BLE, Bluetooth 5.4 I2C, SPI, UART 6 dBm 2 Mb/s - 98.6 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape, MouseReel
Insight SiP Bluetooth-Module – 802.15.1 ISP2053-AX nRF5340 Bluetooth 5.2 LE Audio, DF and Long Range Module 200Auf Lager
Min.: 1
Mult.: 1
GPIO, I2C, I2S, PWM, SPI, UART 8 dBm 2 Mb/s - 104 dBm 2.43 GHz 1.7 V 5.5 V - 40 C + 105 C Tray
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 522Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 1'398Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 273Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin 795Auf Lager
3'000erwartet ab 01.05.2026
Min.: 1
Mult.: 1
Rolle: 1'000

BLE, Bluetooth 5.1 Class 2 I2C, SPI, UART 20 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna, 24 GPIO, 105C 1'901Auf Lager
550Auf Bestellung
Min.: 1
Mult.: 1
Rolle: 100

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8 MHz, 6 dBm, AoA Receive or BLE Long Range PHY Rates(125kbps and 500kbps), LFXO, 512kB, 32kB(RAM), Built-in antenna, 24 GPIO, 105C 3'543Auf Lager
Min.: 1
Mult.: 1
Rolle: 1'000

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 105 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth SiP module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 38.4 MHz, 6 dBm, PLFRCO, 352kB, 32kB(RAM), Built-in antenna/RF pin, 24 GPIO, 85C 1'017Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 I2C, SPI, UART 6 dBm 2 Mb/s - 95.9 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Tray
Silicon Labs Bluetooth-Module – 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, Built-in Antenna 172Auf Lager
Min.: 1
Mult.: 1

MGM210L Bluetooth 5.1 Class 2 I2C, SPI, UART 12.5 dBm 1 Mb/s - 97 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 105 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PLFRCO, 352kB, 32kB(RAM), Built-in antenna, 25 GPIO, 85C 193Auf Lager
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 BGM210L Wireless Gecko Bluetooth Lighting Module, PCB, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna 4Auf Lager
Min.: 1
Mult.: 1

MGM210L Bluetooth 5.1 Class 2 I2C, SPI, UART 12.5 dBm 1 Mb/s - 97 dBm 2.4 GHz 1.8 V 3.8 V - 40 C + 125 C Cut Tape
Fanstel Bluetooth-Module – 802.15.1 Comapct nRF54L15 BLE 6.0 module, 1.5MB flash, 256KB RAM, pads for antenna
975erwartet ab 23.02.2026
Min.: 1
Mult.: 1
Rolle: 1'000

I2C, SPI, UART 3 dBm 125 kb/s, 250 kb/s, 1 Mb/s, 2 Mb/s, 4 Mb/s 2.4 GHz 1.7 V 3.6 V - 40 C + 105 C Reel, Cut Tape
Silicon Labs Bluetooth-Module – 802.15.1 Wireless bluetooth PCB module, Secure Boot w/Root of Trust and Secure Loader(RTSL), 76.8MHz, 8dB, PLFRCO, 352kB, 32kB(RAM), Built-in antenna, 25 GPIO, 85C
3'000erwartet ab 16.02.2026
Min.: 1
Mult.: 1
Rolle: 1'000

BLE, Bluetooth 5.4 I2C, SPI, UART 8 dBm 2 Mb/s - 96.2 dBm 2.44 GHz 1.8 V 3.8 V - 40 C + 85 C Reel, Cut Tape, MouseReel
Silicon Labs Bluetooth-Module – 802.15.1 BGM210P Wireless Gecko Bluetooth Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin Nicht-auf-Lager-Vorlaufzeit 12 Wochen
Min.: 1'000
Mult.: 1'000
Rolle: 1'000

BLE, Bluetooth 5.1 Class 2 I2C 10 dBm 2 Mb/s - 94.1 dBm 2.44 GHz 1.71 V 3.8 V - 40 C + 125 C Reel
Infineon Technologies Bluetooth-Module – 802.15.1 BLE INDUSTRIAL AND IOT Nicht-auf-Lager-Vorlaufzeit 29 Wochen
Min.: 500
Mult.: 500
Rolle: 500

Bluetooth 5.4 Class 1, Class 2 GPIO, I2C, I2S, SPI, UART 10 dBm 125 kb/s, 500 kb/s, 1 Mb/s, 2 Mb/s - 95 dBm, - 98 dBm, - 101 dBm, - 106 dBm 2.4 GHz 2.75 V 3.6 V - 40 C + 85 C Reel
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C
Quectel Bluetooth-Module – 802.15.1 Nicht-auf-Lager-Vorlaufzeit 5 Wochen
Min.: 1
Mult.: 1
BLE, Bluetooth 5.4 UART 2.4 GHz 1.71 V 3.8 V - 40 C + 85 C
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 20 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 3'000
Mult.: 1'000
Rolle: 1'000

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 20 dBm 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C Reel
Quectel Bluetooth-Module – 802.15.1 BT 5.4 & BLE Mesh, 10 dBm max TX power, ARM Cortex-M33 core, 80MHz, -40 ? to +105 ?, PCB antenna Nicht-auf-Lager-Vorlaufzeit 15 Wochen
Min.: 3'000
Mult.: 1'000
Rolle: 1'000

BLE, Bluetooth 5.4 ADC, GPIO< I2C, I2S, JTAG, PWM, SPI, SWD, UART 10 dBm 2.4 GHz 1.71 V 3.8 V - 40 C + 105 C Reel