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Bourns BTJ Thermal Jumper Chips
Bourns BTJ Thermal Jumper Chips
02.02.2026
Einzigartige oberflächenmontierbare Bauelemente, die eine hohe Wärmeleitfähigkeit zur Dissipation bieten.
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Bourns BTJ Thermal Jumper Chips
Bourns BTJ Thermal Jumper Chips
02.02.2026
Einzigartige oberflächenmontierbare Bauelemente, die eine hohe Wärmeleitfähigkeit zur Dissipation bieten.
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
Advanced Thermal Solutions Thermal Transfer Plates for NVIDIA® Jetson™
11.06.2025
Designed for targeted heat management for NVIDIA® Jetson™ modules lacking integrated thermal plates.
Laird Technologies Tflex™ HR6.5 Thermal Gap Filler
Laird Technologies Tflex™ HR6.5 Thermal Gap Filler
09.15.2025
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers
Laird Technologies Tflex™ CR350S 2-Part Dispensable Gap Fillers
09.09.2025
Provide high thermal conductivity, low thermal resistance, and high reliability.
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap Fillers
Laird Technologies Tputty™ SF560 1-Part Dispensable Gap Fillers
08.25.2025
Designed to offer thermal conductivity of 5.6W/mK, along with superior thermal resistance.
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap Filler
Laird Technologies Tflex™ CR550 2-Part Dispensable Gap Filler
10.25.2024
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Laird Technologies Tflex SF4 Thermal Gap Fillers
Laird Technologies Tflex SF4 Thermal Gap Fillers
09.10.2024
Silicon-free and offers a 0.5mm to 4mm thickness range with 4.0W/mK thermal conductivity.
Laird Technologies Tflex SF7 Thermal Gap Fillers
Laird Technologies Tflex SF7 Thermal Gap Fillers
09.10.2024
Innovative, high-performing thermal material with silicone-free construction.
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
Bergquist Company TGF 2900LVO 2.9W/m-K Limited Outgassing Gap Filler
05.30.2024
Silicone, two-part room-temperature curable gap filler ideal for electronic assembly applications.
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
Bergquist Company TGP 40000SF 40W/m-K Silicone Free GAP PAD®
05.27.2024
Features gap-filling materials that achieve an ultra-high 40W/m-K thermal conductivity.
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
Stackpole Electronics TMJ Surface Mount Thermal Jumper Chip Resistors
01.18.2024
Features chip sizes ranging from 0603 to 2512.
MG Chemicals Non-Silicone Liquid Thermal Gel
MG Chemicals Non-Silicone Liquid Thermal Gel
10.30.2023
1-part gel that offers extreme thermal conductivity and flame retardancy.
LeaderTech TCF Extrem flache Wärmeleitpads aus Kohlefaser
LeaderTech TCF Extrem flache Wärmeleitpads aus Kohlefaser
10.18.2023
Geringer Wärmewiderstand, weiche Oberfläche und verwendet hauptsächlich Carbonfaser als wärmeleitender Füllstoff.
LeaderTech TGN Extrem flache Wärmeleitpads
LeaderTech TGN Extrem flache Wärmeleitpads
10.18.2023
Verfügen über einen niedrigen thermischen Widerstand und werden durch die Kombination von Graphen und Silikon hergestellt. 
LeaderTech TCI Composite Indium Sheet
LeaderTech TCI Composite Indium Sheet
10.18.2023
Übergänge von Feststoff zu Flüssigkeit an seinem Schmelzpunkt und wieder zu Feststoff bei Raumtemperatur.
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
Wakefield Thermal 127-12 Extreme Performance Sil-Free Thermal Grease
09.27.2023
Feature extreme performance, phase change, and non-silicone with 12W/m-K thermal conductivity.
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal Grease
Wakefield Thermal 127-6 High-Performance, Sil-Free Thermal Grease
09.13.2023
High-performance, non-silicone thermal grease syringe with 6W/m-K thermal conductivity.
Laird Technologies CoolZorb 200 Hybrid TIM/EMI Absorbers
Laird Technologies CoolZorb 200 Hybrid TIM/EMI Absorbers
09.08.2023
Hybrid absorber/thermal management materials used for EMI mitigation and heat dissipation.
Bergquist Company Anwendungen für Rechenzentren
Bergquist Company Anwendungen für Rechenzentren
04.01.2023
Fortschrittliche Materialien unterstützen das Wärmemanagement, die langfristige Zuverlässigkeit und den Überlastungsschutz.
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
Laird Technologies Tflex™ HD7.5 Thermal Gap Filler
08.03.2022
Soft silicone material that offers high deflection and 7.5W/mK thermal conductivity.
Laird Technologies Tpcm™ 7000 High-Performance TIMs
Laird Technologies Tpcm™ 7000 High-Performance TIMs
08.03.2022
Designed to enhance the cooling of the thermal challenges in electronics.
Laird Technologies Tpcm™ 5000 High-Performance TIM
Laird Technologies Tpcm™ 5000 High-Performance TIM
07.19.2022
Features low thermal resistance and a non-silicone formulation with a naturally tacky surface.
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
Bergquist Company Liqui-Form TLF 10000 10W/m-K Thermal Gel
07.11.2022
Assures high thermal conductivity, good dispensing efficiency, and high thermal reliability.
Laird Technologies Ttape™ 1000A Thermally Conductive Tape
Laird Technologies Ttape™ 1000A Thermally Conductive Tape
06.03.2022
Pressure-sensitive adhesive with low thermal resistance, only needs finger pressure for application.
Bergquist Company EV Charging Solutions
Bergquist Company EV Charging Solutions
04.13.2022
Designed to provide safe charging while protecting EV battery packs from thermal/electrical events.
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