SLIMDIP™ Modules

Mitsubishi Electric SLIMDIP™ Modules are offered in an ultra-small, compact, transfer mold package that contributes to downsizing and weight reduction of inverter systems for home appliances. The SLIMDIP series integrates a reverse conducting IGBT (RC-IGBT) that applies the 7th-generation technology as a power chip. With integrated power chips, drive, and protection circuits, the SLIMDIP devices are ideal for AC 100V-240V class low-power motor inverter control. Mitsubishi Electric SLIMDIP Modules feature a transfer-molded structure that incorporates a high thermal conductivity insulation sheet, providing heat. The SLIMDIP lineup includes the SLIMDIP-L and SLIMDIP-S.

Ergebnisse: 6
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Menge RoHS ECAD Model Typ
Sättigungsspannung Kollektor-Emitter
Kollektorgleichstrom bei 25 C
Kollektor-Emitterspannung VCEO max.
Montageart
Technologie
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt

3-Phase IGBT Inverter 600 V 0.416666667 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt

3-Phase IGBT Inverter 600 V 15 A 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt

3-Phase IGBT Inverter 600 V 15 A 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt

3-Phase IGBT Inverter 600 V 0.208333333 600 V Through Hole Si - 30 C + 150 C


Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt
Weitere Infos Verfügbar

3-Phase IGBT Inverter 600 V 20 A 600 V Through Hole Si - 30 C + 150 C
Mitsubishi Electric Intelligente Leistungsmodule – IPMs SLIMDIP IPM 6-PAC
Datenblatt

600 V 30 A 600 V Through Hole Si - 30 C + 150 C