3D-MID Component Carriers

HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilising fully automated assembly and soldering. These 3D moulded interconnect devices can replace circuit boards utilising a 3-dimensional circuit on moulded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilise a high-temperature thermoplastic, enabling compatibility with reflow soldering.