|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-06-2-K-TR
- Samtec
-
325:
CHF 11.92
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.0-S-08-1-K-TR
- Samtec
-
325:
CHF 14.90
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM30010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-04-1-K-TR
- Samtec
-
450:
CHF 8.97
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-1-K-TR
- Samtec
-
1:
CHF 19.89
-
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
Mouser-Teilenr.
200-LPAM30015L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
|
|
CHF 19.89
|
|
|
CHF 19.02
|
|
|
CHF 18.31
|
|
|
CHF 16.96
|
|
|
CHF 14.58
|
|
|
CHF 14.13
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-L-08-2-K-TR
- Samtec
-
300:
CHF 14.27
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAM30015L082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-04-2-K-TR
- Samtec
-
450:
CHF 9.72
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
|
CHF 9.72
|
|
|
CHF 8.84
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-06-2-K-TR
- Samtec
-
300:
CHF 11.98
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM30015S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-1-K-TR
- Samtec
-
300:
CHF 15.52
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM30015S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-30-01.5-S-08-2-K-TR
- Samtec
-
300:
CHF 15.52
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAM30015S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
- LPAM-40-01.0-L-04-2-K-TR
- Samtec
-
475:
CHF 11.07
-
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
Mouser-Teilenr.
200-LPAM40010L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder 1.27MM LP ARRAY HS HD LOW PRO
|
|
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
|
Min.: 475
Mult.: 475
:
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-06-1-K-TR
- Samtec
-
325:
CHF 13.17
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM40010L061KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-L-08-1-K-TR
- Samtec
-
1:
CHF 24.84
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40010L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
|
CHF 24.84
|
|
|
CHF 23.76
|
|
|
CHF 22.87
|
|
|
CHF 21.20
|
|
|
CHF 17.21
|
|
|
Anzeigen
|
|
|
CHF 18.20
|
|
|
CHF 16.73
|
|
|
Kostenvoranschlag
|
|
Min.: 1
Mult.: 1
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel, Cut Tape
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-06-2-K-TR
- Samtec
-
325:
CHF 15.21
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAM40010S062KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 325
Mult.: 325
:
325
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.0-S-08-1-K-TR
- Samtec
-
300:
CHF 19.41
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM40010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-1-K-TR
- Samtec
-
450:
CHF 11.66
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015L041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-04-2-K-TR
- Samtec
-
450:
CHF 11.66
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015L042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-L-08-1-K-TR
- Samtec
-
300:
CHF 17.16
-
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
Mouser-Teilenr.
200-LPAM40015L081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 2 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-1-K-TR
- Samtec
-
450:
CHF 12.78
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015S041KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-40-01.5-S-04-2-K-TR
- Samtec
-
450:
CHF 12.78
-
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
Mouser-Teilenr.
200-LPAM40015S042KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 11 Wochen
|
|
Min.: 450
Mult.: 450
:
450
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-1-K-TR
- Samtec
-
300:
CHF 22.68
-
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
Mouser-Teilenr.
200-LPAM50010S081KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 8 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.0-S-08-2-K-TR
- Samtec
-
300:
CHF 23.17
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM50010S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAM-50-01.5-S-08-2-K-TR
- Samtec
-
300:
CHF 25.67
-
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
Mouser-Teilenr.
200-LPAM50015S082KTR
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 3 Wochen
|
|
Min.: 300
Mult.: 300
:
300
|
|
|
Headers
|
|
1.27 mm (0.05 in)
|
|
Solder
|
Straight
|
|
2.2 A
|
250 V
|
|
- 55 C
|
+ 125 C
|
Gold
|
Copper Alloy
|
Liquid Crystal Polymer (LCP)
|
LPAM
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-10-03.5-L-04-1-K-TR
- Samtec
-
650:
CHF 6.85
-
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAF1003.5L041K
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 7 Wochen
|
|
|
CHF 6.85
|
|
|
CHF 6.74
|
|
Min.: 650
Mult.: 650
:
650
|
Nein
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
LPAF
|
Reel
|
|
|
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-20-03.0-L-08-1-K-TR
- Samtec
-
350:
CHF 10.64
-
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
Mouser-Teilenr.
200-LPAF2003.0L081K
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 4 Wochen
|
|
Min.: 350
Mult.: 350
:
350
|
Nein
|
|
|
|
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LPAF
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Reel
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Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
- LPAF-40-03.0-L-04-1-K-TR
- Samtec
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550:
CHF 9.16
-
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
-
Neues Produkt
|
Mouser-Teilenr.
200-LPAF4003.0L041K
Neues Produkt
|
Samtec
|
Platine-zu-Platine & Mezzanine-Steckverbinder .050 LP Array High-Speed High-Density Low Profile Open-Pin-Field Array
|
|
Nicht-auf-Lager-Vorlaufzeit 6 Wochen
|
|
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CHF 9.16
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|
|
CHF 8.92
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Min.: 550
Mult.: 550
:
550
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Nein
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LPAF
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Reel
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