|
|
Entwicklungsplatinen & -kits - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
- conga-SEVAL
- congatec
-
1:
CHF 557.52
-
30Auf Lager
|
Mouser-Teilenr.
787-007010
|
congatec
|
Entwicklungsplatinen & -kits - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
|
|
30Auf Lager
|
|
Min.: 1
Mult.: 1
|
|
Development Boards & Kits - x86
|
Carrier Boards
|
CAN, GPIO, I2C, I2S, PCIe, SATA, SDIO, SPI, RS-232, USB
|
|
|
|
Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
- conga-SMC1/SMARC-ARM
- congatec
-
1:
CHF 238.28
-
9Auf Lager
-
29Auf Bestellung
|
Mouser-Teilenr.
787-020750
|
congatec
|
Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
|
|
9Auf Lager
29Auf Bestellung
Auf Bestellung:
11 erwartet ab 04.09.2026
18 erwartet ab 28.05.2027
Lieferzeit ab Hersteller:
15 Wochen
|
|
Min.: 1
Mult.: 1
|
|
Development Boards & Kits - ARM
|
Carrier Boards
|
Audio, DMIC, DP++, eDP/DSI, GPIO, HDMI, I2C, I2S, LVDS, Micro SD Card, MIPI CSI, mPCIe, RJ45, RS-232/422/485, SATA, SPI/eSPI, USB
|
|
|
|
Netzwerkentwicklungstools STM32MP expansion board for industrial IoT gateway
- X-STM32MP-IGTW1
- STMicroelectronics
-
1:
CHF 73.25
-
19Auf Lager
-
Neues Produkt
|
Mouser-Teilenr.
511-X-STM32MP-IGTW1
Neues Produkt
|
STMicroelectronics
|
Netzwerkentwicklungstools STM32MP expansion board for industrial IoT gateway
|
|
19Auf Lager
|
|
Min.: 1
Mult.: 1
Max.: 5
|
|
Networking Development Tools
|
Evaluation Boards
|
I2C, UART
|
|
|
|
IC-Entwicklungstools für Datenkonvertierung XTR108 Eval Module U SB Version
- XTR108EVM-USB
- Texas Instruments
-
1:
CHF 438.41
-
3Auf Lager
|
Mouser-Teilenr.
595-XTR108EVM-USB
|
Texas Instruments
|
IC-Entwicklungstools für Datenkonvertierung XTR108 Eval Module U SB Version
|
|
3Auf Lager
|
|
Min.: 1
Mult.: 1
Max.: 5
|
|
Data Conversion IC Development Tools
|
Evaluation Boards
|
|
|
|
|
Entwicklungsplatinen & -kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
- conga-SMC1/SMARC-x86
- congatec
-
1:
CHF 246.06
-
77Auf Bestellung
|
Mouser-Teilenr.
787-020751
|
congatec
|
Entwicklungsplatinen & -kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
|
|
77Auf Bestellung
Auf Bestellung:
26 erwartet ab 01.04.2027
51 erwartet ab 22.04.2027
Lieferzeit ab Hersteller:
41 Wochen
|
|
Min.: 1
Mult.: 1
|
|
Development Boards & Kits - x86
|
Evaluation Boards
|
|
|
|
|
Entwicklungsboards und Kits - Andere Prozessoren Evaluation Kit for Qorivva MPC5510, Includes MPC5510EVB Motherboard and MPC5510ADAP144 daughter card
- MPC5510KIT144
- NXP Semiconductors
-
1:
CHF 1’043.15
-
Nicht-auf-Lager-Vorlaufzeit 53 Wochen
|
Mouser-Teilenr.
841-MPC5510KIT144
|
NXP Semiconductors
|
Entwicklungsboards und Kits - Andere Prozessoren Evaluation Kit for Qorivva MPC5510, Includes MPC5510EVB Motherboard and MPC5510ADAP144 daughter card
|
|
Nicht-auf-Lager-Vorlaufzeit 53 Wochen
|
|
Min.: 1
Mult.: 1
|
|
Development Boards & Kits - Other Processors
|
Development Kits
|
CAN, LIN, RS-232
|
|
|
|
Kamera-Development-Tools AI Camera DEV Kit, Jetson Nano, 8MP, 30 fps
ADLINK Technology AI Camera DEV Kit
- AI Camera DEV Kit
- ADLINK Technology
-
1:
CHF 463.31
-
Nicht auf Lager
|
Mouser-Teilenr.
976-AICAMERADEVKIT
|
ADLINK Technology
|
Kamera-Development-Tools AI Camera DEV Kit, Jetson Nano, 8MP, 30 fps
|
|
Nicht auf Lager
|
|
Min.: 1
Mult.: 1
|
|
Camera Development Tools
|
Development Kits
|
DP, Ethernet, UART, USB 2.0, USB 3.0, USB OTG
|
|
