ARM Cortex-M33 Kern Drahtlose & HF-Module

Arten von drahtlosen & HF-Modulen
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Ergebnisse: 54
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Menge RoHS Produkt-Typ
Produkt
Frequenz
Schnittstellen-Typ
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Protokoll – Sub-GHz
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000
Multiprotocol Modules Multi Protocol Modules 80 MHz I2C, I2S, SPI, UART BLE 5.3 Zigbee 3.0
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 802.11a/b/g/n/ac/ax
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500
Multiprotocol Modules Modules 2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB