+ 125 C Multiprotokoll-Module

Ergebnisse: 38
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
NXP Semiconductors Multiprotokoll-Module IW610GUK/A1ZDI
Datenblatt
25erwartet ab 29.07.2026
Min.: 1
Mult.: 1
: 2’000

IW610GUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
Silicon Labs Multiprotokoll-Module MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
1’240Auf Lager
6’000erwartet ab 25.12.2026
Min.: 1
Mult.: 1
: 1’000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotokoll-Module MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
380Auf Lager
Min.: 1
Mult.: 1
: 1’000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Telink Multiprotokoll-Module Telink Semiconductor is a fabless IC design company of state-of-the art wireless connectivity SoCs. Through years of research and development, Telink has built a comprehensive product portfolio and become one of the world-leading IC suppliers in this
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

ML3 2.4 GHz to 2.483 GHz 8.4 dBm I2C, SPI, UART 1.8 V 4.3 V - 40 C + 125 C 26 mm x 11.3 mm x 2.6 mm Zigbee Reel
NXP Semiconductors Multiprotokoll-Module IW610BUK/A1ZDI
Datenblatt
25Auf Lager
Min.: 1
Mult.: 1
: 2’000

IW610BUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datenblatt
200Auf Lager
Min.: 1
Mult.: 1

MGM210L 2.4 GHz 12.5 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 125 C PCB 12.5 mm x 15.5 mm x 2.25 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610CUK/A1ZDI
Datenblatt
25erwartet ab 29.07.2026
Min.: 1
Mult.: 1
: 2’000

IW610CUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Reel, Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610GHN/A1ZDI
Datenblatt
1’240Auf Lager
Min.: 1
Mult.: 1

IW610GHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
223Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
2’752Auf Lager
Min.: 1
Mult.: 1
: 1’000

2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape


Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
62Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
177Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
164Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
133Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 10 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module 802.15.4 and Bluetooth Low Energy 5.4 Multiprotocol Wireless Module
Datenblatt
149Auf Lager
Min.: 1
Mult.: 1

MGM260P 2.4 GHz 20 dBm ADC, GPIO, I2C, I2S, IrDA, JTAG, SPI, UART, USART 1.8 V 3.8 V - 40 C + 125 C 12.9 mm x 15 mm Bluetooth, BLE Thread, Zigbee - 802.15.4 Cut Tape
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
1’387Auf Lager
1’000erwartet ab 30.10.2026
Min.: 1
Mult.: 1
: 1’000

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Reel, Cut Tape
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +20 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
623Auf Lager
1’000Auf Bestellung
Min.: 1
Mult.: 1

MGM210P 2.4 GHz 20 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Murata Electronics Multiprotokoll-Module Shielded Small Wi-Fi 11a/b/g/n/ac/ax 2x2 MIMO + Bluetooth 5.3 Module
Datenblatt
556Auf Lager
MouseReel verfügbar
Min.: 1
Mult.: 1
: 1’000

2XS 2.4 GHz, 5 GHz 18 dBm PCIe, SDIO, UAR 1.71 V 3.46 V - 40 C + 125 C 19.2 mm x 16.5 mm x 2.1 mm Bluetooth 5.3 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Silicon Labs Multiprotokoll-Module Wireless gecko multi-protocol module, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, built-in antenna, certified.
Datenblatt
8Auf Lager
Min.: 1
Mult.: 1

MGM210P 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
Silicon Labs Multiprotokoll-Module MGM210P Wireless Gecko Multiprotocol Module, PCB, Secure Vault, +10 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, Built-in Antenna & RF Pin
Datenblatt
37Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 125 C Built-In, RF 12.9 mm x 15 mm x 2.2 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Cut Tape
NXP Semiconductors Multiprotokoll-Module IW610FUK/A1ZDI
Datenblatt
25erwartet ab 29.07.2026
Min.: 1
Mult.: 1
: 2’000

IW610FUK 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape
Microchip Technology Multiprotokoll-Module Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Datenblatt
144erwartet ab 24.09.2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Tray
NXP Semiconductors Multiprotokoll-Module IW610BHN/A1ZDI
Datenblatt
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1

IW610BHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610CHN/A1ZDI
Datenblatt
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1

IW610CHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE - 802.15.4 WiFi 6 Tray
NXP Semiconductors Multiprotokoll-Module IW610FHN/A1ZDI
Datenblatt
25erwartet ab 29.10.2026
Min.: 1
Mult.: 1
: 2’700

IW610FHN 2.4 GHz, 5 GHz 23 dBm SDIO, SPI, UART, USB 3.14 V 3.46 V - 40 C + 125 C Bluetooth, BLE WiFi 6 Reel, Cut Tape