ARM Cortex-M33 Kern Multiprotokoll-Module

Ergebnisse: 34
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Silex Technology Multiprotokoll-Module IM-100 is a small, stand-alone, dual-band Wi-Fi 6 and Bluetooth Low Energy
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Silex Technology Multiprotokoll-Module the option to attach an antenna via a trace. does not include the u.Fl connector
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel
Silex Technology Multiprotokoll-Module the option to attach an antenna via a trace does not include the u.Fl connector
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 1
Mult.: 1

260 MHz I2C, SPI, UART - 40 C + 85 C 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Cut Tape
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: PCB
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 768 KB Flash, 64 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 500
Mult.: 500
: 500
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C PCB Antenna 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: PCB
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotokoll-Module Zigbee 3.0 (IEEE 802.15.4) & BLE 5.4, supports BLE mesh, multi-protocol coexistence, 1024 KB Flash, 96 KB SRAM, up to 20dBm, Antenna: 1st gen RF coax
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000
80 MHz 20 dBm I2C, I2S, SPI, UART 1.71 V 3.8 V - 40 C + 85 C RF Coaxial Connector 20 mm x 12 mm x 2.2 mm BLE 5.3 Zigbee 3.0 Reel
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: 4th gen RF coax, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C RF Connector 25.5 mm x 18 mm x 3.16 mm 802.11a/b/g/n/ac/ax Reel
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM + 8MB PSRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 18 Wochen
Min.: 500
Mult.: 500
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel