dualFLOW™/quadFLOW™ CPU Coolers for Servers

Advanced Thermal Solutions dualFLOW™/quadFLOW™ CPU Coolers for Servers are designed for 1U and 2U applications where space and airflow are restricted. These heat sinks have a Pulse Width Modulation-enabled blower with 10.8VDC to 13.2VDC operating voltage. A vapor chamber base option improves heat spreading when the heat source is small or not uniform while an optional standard backing plate accommodates the cooling of any high-powered device. ATS dualFLOW/quadFLOW CPU Coolers offer at least 20% improvement over comparable products on the market. These devices have a nickel-plated finish.

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Advanced Thermal Solutions Heat Sinks Ultra Cool QuadFLOW Heat Sink, 1U, Cu Fins, Nickel Plate
Datasheet
17In Stock
Min.: 1
Mult.: 1

Heat Sinks LGA2011, LGA2066 Screw Copper 0.2 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions Heat Sinks Ultra Cool DualFLOW Heat Sink, 1U, Al Fins, Nickel Plate
Datasheet
22In Stock
Min.: 1
Mult.: 1

Heat Sinks
Advanced Thermal Solutions Heat Sinks Ultra Cool QuadFLOW Heat Sink, 1U, Al Fins, Nickel Plate
Datasheet
60In Stock
Min.: 1
Mult.: 1

Heat Sinks LGA2011, LGA2066 Screw Aluminum 0.21 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions Heat Sinks Ultra Cool DualFLOW Heat Sink, 1U, Vapor Chamber
Datasheet
2In Stock
Min.: 1
Mult.: 1

Heat Sinks LGA2011, LGA2066 Screw 0.2 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions Heat Sinks Ultra Cool DualFLOW Heat Sink, 1U, Cu Fins, Nickel Plate
Datasheet
17Expected 10/15/2026
Min.: 1
Mult.: 1

Heat Sinks LGA2011, LGA2066 Screw 0.19 C/W 92.38 mm 92.11 mm 29 mm
Advanced Thermal Solutions Heat Sinks Ultra Cool QuadFLOW Heat Sink, 1U, Vapor Chamber
Datasheet
209Factory Stock Available
More Info Available
Min.: 25
Mult.: 5

Heat Sinks LGA2011, LGA2066 Screw Copper 0.2 C/W 92.38 mm 92.11 mm 29 mm