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congatec Entwicklungsplatinen & -kits - x86 Evaluation carrier board for standard SMARC modules based on SMARC Specification 2.1.1
Datenblatt
30Auf Lager
Min.: 1
Mult.: 1

congatec Entwicklungsplatinen & -kits - x86 EVALUATION CARRIER BRD FOR QSEVEN 2.0
Datenblatt
6Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i3-7100U dual core processor with 2.4GHz, 3MB Intel Smart Cache , GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
Datenblatt
19Auf Lager
Min.: 1
Mult.: 1

congatec Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)
Datenblatt
20Auf Lager
18erwartet ab 28.05.2027
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface
Datenblatt
90Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr
Datenblatt
9Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module based on Intel Core i7-8665UE 4-core processor with 1.7GHz up to 4.4GHz turbo boost, 8MB L2 cache, Intel UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (formerly Whiskey Lake).
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM SMARC 2.0 module with advanced low-power 14nm NXP i.MX 8M Mini Quad processor. Features 4x ARM Cortex-A53 @1.8GHz and 1x ARM Cortex-M4, 2GB onboard LPDDR4 memory and 16GB onboard eMMC. Commercial temperature range.
Datenblatt
1Auf Lager
1Auf Bestellung
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard Heatspreader for SMARC 2.0 module conga-SA5* For modules with IHS Intel Atom CPU* All stand-offs are bore hole 2.7mm
Datenblatt
33Auf Lager
Min.: 1
Mult.: 1


congatec Computerkabel RS232 console adaptor cable 62Auf Lager
Min.: 1
Mult.: 1



congatec CPU- und Chip-Kühler Passive cooling solution for SMARC module conga-SMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole.
Datenblatt
11Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1

congatec CPU- und Chip-Kühler Passive cooling solution for COM Express Compact module conga-TCA7 with lidded Intel Atom processor. thread
Datenblatt
11Auf Lager
Min.: 1
Mult.: 1

congatec CPU- und Chip-Kühler Standard passive cooling solution for high performance COM-HPC module conga-HPC/cTLUwith integrated heatpipe, 28mm height. All standoffs are with 2.7mm bore hole.
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

congatec Computer-On-Module - COM COM-HPC Size D module based on Intel Xeon D1712TR 4-core processor with tbd GHz, 10MB cache and dual channel DDR4 2666 MT/s memory interface (formerly Ice Lake-D LCC). Commercial temperature range.
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1


congatec Wärmeableitungen Heat spreader solution for SMARC module conga-SMX8-X with lidded NXP i.MX 8X ARM processor. All standoffs are with 2.7mm bore hole.
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard heatspreader for Qseven module conga-QA7 with lidded Intel Atom x6000E processors. All standoffs are with 2.7mm bore hole.
Datenblatt
12Auf Lager
Min.: 1
Mult.: 1
congatec Wärmeableitungen Standard passive cooling for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
Datenblatt
4Auf Lager
Min.: 1
Mult.: 1

congatec CPU- und Chip-Kühler Standard active cooling solution and integrated 12V fan for conga-JC370 (bore hole). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 3Auf Lager
Min.: 1
Mult.: 1
congatec Wärmeableitungen Standard heatspreader for COM Express Mini Type10 module conga-MA5* For modules with IHS (lidded) CPU* All stand-offs are M2.5 threaded
Datenblatt
24Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard heatspreader for Qseven module conga-QA5* For modules with IHS CPU* With bore hole 2.7mm stand-offs.
Datenblatt
3Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard passive cooling for COM Express Mini Type10 module conga-MA5* Heatstack cooling for modules with standard CPU (open silicone die)* All stand-offs are M2.5 threaded
Datenblatt
14Auf Lager
Min.: 1
Mult.: 1

congatec Wärmeableitungen Standard heatspreader for high performance COM-HPC module conga-HPC/cTLU with integrated heatpipe, 13mm height. All standoffs are with 2.7mm bore hole.
Datenblatt
1Auf Lager
Min.: 1
Mult.: 1
congatec CPU- und Chip-Kühler Standard active cooling solution and integrated 12V fan for conga-JC370 (threaded). 16mm fins, 21mm overall heat sink height and total height 27.3mm. 2Auf Lager
Min.: 1
Mult.: 1
congatec Wärmeableitungen Standard heatspreader for COMe mini module conga-MA7 with lidded Intel Atom Exxx processor. All standoffs are with 2.7mm bore hole.
Datenblatt
2Auf Lager
Min.: 1
Mult.: 1