FGA66XABMD

Quectel
277-FGA66XABMD
FGA66XABMD

Mfr.:

Description:
Multiprotocol Modules Wi-Fi 6 (2.4GHz/5GHz), ?IEEE 802.11a/b/g/n/ac/ax, BLE 5.4, Thread 802.15.4, Antenna 1 1 (1T1R), 2 antennas, Wi-Fi application: SDIO 3.0, -40C +85C

Lifecycle:
New Product:
New from this manufacturer.
Datasheet:
ECAD Model:
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More Information
Learn more about Quectel FGA66XABMD
Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.

Product Attribute Attribute Value Select Attribute
Quectel
Product Category: Multiprotocol Modules
Delivery Restrictions:
 Product available only to OEM/EMS and design business customers. Product is not shipped to consumers in the EU or the UK. This product will require additional documentation to export from the United States.
2.4 GHz, 5 GHz
SPI, UART, USB
3.14 V
3.46 V
- 40 C
+ 85 C
PCB Antenna
23 mm x 14 mm x 2.2 mm
BLE 5.4
802.11 a/b/g/n/ac/ax
Reel
Cut Tape
Brand: Quectel
Data Rate: 114.7 Mb/s
Modulation Technique: DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM
Mounting Style: SMD/SMT
Operating Supply Voltage: 3.3 V
Product Type: Multiprotocol Modules
Factory Pack Quantity: 500
Subcategory: Wireless & RF Modules
Type: Wi-Fi 6, BLE 5.4
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Attributes selected: 0

Datasheet

Origin Classifications
Country of Origin:
China
Assembly Country of Origin:
Not available
Country of Diffusion:
Not available
The country is subject to change at the time of shipment.

FGA66X Wi-Fi 6, BLE 5.4 & IEEE 802.15.4 Modules

Quectel FGA66X Wi-Fi 6, BLE 5.4, and IEEE 802.15.4 Modules are high-performance modules in an LGA package and support the IEEE 802.11ax standard protocol. These modules operate at MCS 0 to MCS 9 rates over a 20MHz bandwidth and 256QAM. The FGA66X modules are designed with a reliable SDIO 3.0 and USB interface to provide WLAN capability. The low profile and small size of the LGA package enable the modules to be easily embedded in size-constrained applications and to provide reliable connectivity. The FGA66X modules are available in an ultra-compact size of 23mm x 14mm x 2.2mm to meet the demands of size-sensitive applications. These modules operate over a wide temperature range of -40°C to 85°C and are available in an LGA package. The FGA66X modules are ideal for a variety of smart home and industrial applications.

Availability

Stock:
0

You can still purchase this product for backorder.

On Order:
100
Expected 9/11/2026
Factory Lead Time:
32
Weeks Estimated factory production time for quantities greater than shown.
Long lead time reported on this product.
Minimum: 1   Multiples: 1
Unit Price:
CHF -.--
Ext. Price:
CHF -.--
Est. Tariff:

Pricing (CHF)

Qty. Unit Price
Ext. Price
CHF 11.38 CHF 11.38
CHF 9.89 CHF 98.90
CHF 9.39 CHF 234.75
CHF 8.69 CHF 869.00
CHF 8.26 CHF 2’065.00
Full Reel (Order in multiples of 500)
CHF 7.96 CHF 3’980.00

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