ARM Cortex-M33 Kern Multiprotokoll-Module

Ergebnisse: 34
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Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Verpackung
Silicon Labs Multiprotokoll-Module 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datenblatt
771Auf Lager
Min.: 1
Mult.: 1

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Tray
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Trace Pin, Cut Tape
Datenblatt
799Auf Lager
Min.: 1
Mult.: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
u-blox Multiprotokoll-Module RW612, 802.11ax+BLE+802.15.4, antenna pin, open CPU
Datenblatt
1’241Auf Lager
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C Antenna Pin 16.8 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ax 802.15.4 Reel, Cut Tape
Murata Electronics Multiprotokoll-Module Type 2FP is NXP RW610 based Hostless dual band Wi-Fi 6 + BLE 5.4 Module
Datenblatt
76Auf Lager
Min.: 1
Mult.: 1
: 1’000
260 MHz 12 dBm 3.14 V 3.46 V - 40 C + 85 C 12 mm x 11 mm x 1.55 mm Bluetooth WiFi Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, Trace ANT, Cut Tape
Datenblatt
156Auf Lager
Min.: 1
Mult.: 1

BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, MHF4, Cut Tape
Datenblatt
226Auf Lager
Min.: 1
Mult.: 1

BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Cut Tape
u-blox Multiprotokoll-Module RW612, 802.11ax+BLE+802.15.4, PCB ant., open CPU
Datenblatt
683Auf Lager
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.17 V 3.45 V - 40 C + 85 C PCB Antenna 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module RW612, 802.11ax+BLE+802.15.4, PCB ant, open CPU, 16MB
Datenblatt
697Auf Lager
500erwartet ab 14.09.2026
MouseReel verfügbar
Min.: 1
Mult.: 1
: 250

2.4 GHz, 5 GHz 11 dBm 3.15 V 3.45 V - 40 C + 85 C Embedded PCB Bluetooth LE/IEEE 802.15.4 802.11 a/b/g/n/ac/ax Reel, Cut Tape, MouseReel
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C - Without the 4-pin header
Datenblatt
249Auf Lager
Min.: 1
Mult.: 1
: 250
2.4 GHz/5 GHz I2C, SPI, UART 4.5 V 5.5 V - 40 C + 85 C PCB 38.3 mm x 21.6 mm x 4.75 mm Bluetooth 5.3 802.11 b/g/n/ax Reel, Cut Tape
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: IPEX, -40 85C - Without the 4-pin header
Datenblatt
250Auf Lager
Min.: 1
Mult.: 1
: 250
2.4 GHz/5 GHz I2C, SPI, UART 4.5 V 5.5 V - 40 C + 85 C RF 38.3 mm x 21.6 mm x 4.75 mm Bluetooth 5.3 802.11 b/g/n/ax Reel, Cut Tape
Quectel Multiprotokoll-Module Amazon Sidewalk IoT module (US version only)
Datenblatt
100Auf Lager
Min.: 1
Mult.: 1
: 500

2.4 GHz I2C, SPI, UART 1.8 V 3.3 V - 40 C + 85 C 15 mm x 15 mm x 2.25 mm BLE 5.1 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Cut Tape
Datenblatt
4’294Auf Bestellung
Min.: 1
Mult.: 1

BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Chip Antenna, Tape and Reel
Datenblatt
1’000erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 1’000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, antenna pin, Open CPU, 16MB, NXP RW610 chip
Datenblatt
250erwartet ab 12.10.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
u-blox Multiprotokoll-Module Dual-band Wi-Fi 6, BLE Stand-alone module, PCB antenna, Open CPU, 16MB, NXP RW610 chip
Datenblatt
750erwartet ab 31.12.2026
Min.: 1
Mult.: 1
: 250

IRIS-W10 2.4 GHz, 5 GHz 11 dBm GPIO, I2C, SPI, UART, USB 3.15 V 3.45 V - 40 C + 85 C U.FL 20.9 mm x 14.6 mm x 2.1 mm Bluetooth LE 802.11 a/b/g/n/ac/ax 802.15.4 Reel, Cut Tape
Quectel Multiprotokoll-Module Wi-Fi 6, dual band (2.4 GHz/5 GHz), BLE 5.3, ARM Cortex-M33, 260MHz, 1.2MB SRAM, 8MB Flash, Antenna: PCB, -40 85C, ultra-compact LCC + LGA package size of 25.5 x 18.0 x 3.16 mm
Datenblatt
100Auf Bestellung
Min.: 1
Mult.: 1
: 500
2.4 GHz, 5 GHz GPIO, I2C, JTAG, SPI, UART, USB 3.14 V 3.46 V - 40 C + 85 C PCB Antenna 25.5 mm x 18 mm x 3.16 mm Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L15, Bluetooth LE, Trace Pin, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1’000
BL54L15u 8 dBm I2S, SPI, UART 1.7 V 3.6 V - 40 C + 105 C 7.9 mm x 6.3 mm x 1.75 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, Trace ANT, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1
Mult.: 1
: 1’000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C Trace 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel, Cut Tape
Ezurio Multiprotokoll-Module Module, BL54L10, Bluetooth LE, MHF4, Tape and Reel
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 16 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000
BL54L10 2.402 GHz to 2.48 GHz 8 dBm I2S, SPI, UART 1.7 V 2.7 V - 40 C + 105 C MHF4 14 mm x 10 mm x 1.6 mm Bluetooth LE 802.15.4 Reel
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 100
Mult.: 100

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 125 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 125 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1
Mult.: 1

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Bluetooth Thread, Zigbee Cut Tape
Silicon Labs Multiprotokoll-Module Mighty Gecko lighting module, +12 dBm, 2.4 GHz, 1 MB Flash, -40 to 105 C, PCB trace antenna, certified.
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 1’000
Mult.: 1’000
: 1’000

2.4 GHz 12.5 dBm I2C, UART 1.8 V 3.8 V - 40 C + 105 C 22.5 mm x 15.5 mm x 2.25 mm Thread, Zigbee Reel
Silicon Labs Multiprotokoll-Module 802.15.4 Module, SiP, Secure Boot with Root of Trust and Secure Loader (RTSL), +6.5 dBm, 2.4 GHz, 768kB flash, 64kB RAM, -40 to +105 C, 26 GPIO, Certified
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 20 Wochen
Min.: 2’500
Mult.: 2’500
: 2’500

MGM270S 76.8 MHz - 40 C + 105 C 6.5 mm x 6.5 mm x 1.3 mm Bluetooth Reel
Silex Technology Multiprotokoll-Module Based on NXP's RW610, IM-100 is a small, stand-alone, dual-band Wi-Fi 6
Datenblatt
Nicht-auf-Lager-Vorlaufzeit 34 Wochen
Min.: 500
Mult.: 500
: 500

260 MHz I2C, SPI, UART - 40 C + 85 C MHF 18 mm x 17 mm x 2.65 mm 802.11 a/b/g/n/ac/ax Reel