Laird Technologies
Laird Technologies designs and develops electronic device protection solutions, including EMI suppression, thermal management materials, structural and precision metals, and multi-functional products. Materials science experts enable improved protection, higher performance and reliability, custom structural designs and faster time-to-market.
Empfohlene Produkte von Laird Technologies
MAF06 High-Current Low DCR SMD Power Inductors
Power line noise suppression and desired power efficiency while delivering extremely low DCR.
Tflex™ HR6.5 Thermal Gap Filler
Thermal interface material with >6W/mK thermal conductivity with high recovery properties.
Tflex™ CR550 2-Part Dispensable Gap Filler
Transfers unwanted heat in automotive components and the A+B putty material cures in place.
Tputty™ 910 1-Part Dispensable Gap Filler
Minimizes stress on components during assembly, offers the reliability of a traditional thermal pad.