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GigaDevice GD32VW553 Multiprotocol loT Combo Modules

GigaDevice GD32VW553 Multiprotocol Internet of Things (IoT) Combo Modules are powered by the high-performance GD32VW553 MCU. Featuring a RISC-V core with a clock speed of up to 160MHz, these wireless modules integrate 2.4GHz Wi-Fi® 6 and BLUETOOTH® LE 5.2 radio modules. These modules deliver outstanding baseband and RF performance to meet the demands of real-time processing and efficient communication.

These GigaDevice wireless modules come with up to 4MB of integrated Flash and 320KB of SRAM, along with a rich array of general-purpose wired interfaces, significantly enhancing development flexibility. Additionally, the devices boast multiple security features that simplify secure connectivity and management for high-performance wireless devices. The GD32VW553 multiprotocol modules also support the Matter over Wi-Fi standard defined by the CSA Connectivity Standards Alliance, enabling smarter and more reliable IoT solutions. These modules accelerate the deployment of wireless solutions across smart home, industrial control, and smart city applications.

Features

  • Built-in GD32VW553 chip, RISC-V 32-bit processor up to 160MHz
    • QFN32 package for GD32VW553-MINI
    • QFN40 package for GD32VW553-UNIFI
  • Built-in 4096KB on-chip Flash memory and 320KB (288KB + 32KB shared) SRAM memory
  • 802.11b/g/n/ax compatible
  • 802.11i (WPA, WPA2, WPA3) open, shared key, and pair-wise key authentication services
  • Single antenna 1x1 stream in 20MHz channels
  • Support of 802.11ax MCS up to MCS9 with a 114.7Mbps maximum PHY rate
  • Bluetooth LE 5.2
  • Support of BLE high-speed 2M PHY and long-range modes (125kbps, 500kbps)
  • Antennas
    • Onboard PCB antenna for GD32VW553-MINI-IMKx and GD32VW553-UNIFI-IMHx
    • External IPEX connector for GD32VW553-MINI-EMKx and GD32VW553-UNIFI-EMHx
  • Peripheral interfaces
    • 20x GPIOs, support of ADC, PWM, UART, I2C, and SPI for GD32VW553-MINI
    • 18x GPIOs, support of ADC, PWM, UART, I2C, and SPI for GD32VW553-UNIFI
  • 3.0V to 3.6V operating voltage range
  • Operating temperature ranges
    • -40°C to +85°C for grade 6
    • -40°C to +105°C for grade 7
  • Module sizes
    • 15mm x 12.4mm x 2.4mm for GD32VW553-MINI-IMKx
    • 9.5mm x 12.4mm x 2.4mm for GD32VW553-MINI-EMKx
    • 24mm x 16mm x 2.4mm for GD32VW553-UNIFI
  • Moisture Sensitivity Level (MSL) 3
  • RoHS-compliant

Applications

  • IoT
  • Smart homes
  • Industrial control
  • Smart cities

Datasheets

GD32VW553-MINI Block Diagrams

Block Diagram - GigaDevice GD32VW553 Multiprotocol loT Combo Modules

GD32VW553-UNIFI Block Diagrams

Block Diagram - GigaDevice GD32VW553 Multiprotocol loT Combo Modules
Veröffentlichungsdatum: 2026-05-11 | Aktualisiert: 2026-05-13