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iWave Global iG-RainboW-G77M Versal AI Edge Gen2 SOM

iWave Global iG-RainboW-G77M Versal AI Edge Gen2 SOM has a form factor of 70mm x 80mm and provides the functional requirements for an embedded application. Three high-speed, receptacle, center strip contact connectors provide the carrier board interface to carry all the I/O signals to and from the iWave Global iG-RainboW-G77M Versal AI Edge Gen2 SOM.

Features

  • SoC
    • Versal AI Edge Gen2 SoC with SSVA2112 package
    • Compatible with 2VE3858, 2VE3804, 2VE3558, 2VE3504 devices
    • Processing system
      • Arm® Cortex-A78AE application processor (up to 1.875GHz)
      • Arm Cortex-R52 real-time processor (up to 875MHz)
      • Arm Mali™ - G78AE with 4-core Graphics Processing Unit (GPU)
      • Supports high speed interfaces like PCI Express Gen5 x4, USB 3.2, DisplayPort 1.4, 10G Ethernet
    • Programmable system
      • System logic cells up to 1,188K logic cells
      • LUTs up to 543K and DSP Engines up to 2,064
      • Supports AI Engine-ML v2 up to 144 tiles
      • Supports 100G multirate Ethernet MAC and PLPCIE5 Gen5 for high-speed connectivity
      • GTYP high-speed transceivers up to 32Gbps
  • Memory interfaces
    • 32-bit 4GB LPDDR5x for PS (expandable)
    • Three 32-bit 4GB LPDDR5x for PL (expandable)
    • 32GB eMMC Flash (expandable)
    • 256MB OSPI Flash
    • 4Kbit EEPROM
    • 64GB UFS Flash (optional)
  • PMIC - Renesas/Dialog’s DA9062 PMIC
  • Other On-SOM features
    • 10/100/1000 Ethernet PHY transceiver
    • FAN header
    • Power and status LEDs
  • Power supply with 5V input through board-to-board connector
  • Board-to-board interfaces
  • From the PS block
    • PS GTYP transceivers x4 up to 32Gbps (PCIe Gen5/10GbE/Aurora)
    • GEM0 through on-SOM Gigabit Ethernet PHY
    • RGMII x1(GEM1)
    • One USB3.2
    • One DP
    • One USB2.0
    • One SD (4-bit)
    • One UART (Debug)
    • One data UART
    • Two I2C
    • One SPI
    • Two CAN FD
    • One JTAG
  • From the PL block
    • PL GTYP transceiver x20 up to 32Gbps
    • FPGA - X5IO Bank 710 with up to 16 LVDS/32 SE IOs and up to one pair of global clock input pins
    • FPGA - X5IO Bank 711 with up to 15 LVDS/30 SE IOs
    • FPGA - X5IO Bank 712 with up to 16 LVDS/32 SE IOs and up to one pair of global clock input pins
    • FPGA - X5IO Bank 713 with up to 14 LVDS/28 SE IOs
    • FPGA - X5IO Bank 706 with up to 16 LVDS/32 SE IOs and up to one pair of global clock input pins
    • FPGA - X5IO Bank 707 with up to 9 LVDS/18 SE IOs
    • FPGA - HDIO Bank 400/402 with up to 44 SE Ios and up to four pairs of global clock input pins
  • -40°C to +85°C component’s temperature support
  • RoHS and REACH compliance
  • 70mm x 80mm (REN+ form factor) form factor

Applications

  • Cloud to networking
  • Wireless and wired communications
  • Edge computing
  • Endpoints
  • Datacenter
  • Test and measurement

Block Diagram

Block Diagram - iWave Global iG-RainboW-G77M Versal AI Edge Gen2 SOM

Development Tool

iWave Global iG-G77D® Versal™ AI Edge Gen2 Development Kit

Includes the necessary on-board connectors to validate the features of the Versal AI Edge Gen2 SOM.

Learn Moreüber iWave Global iG-G77D® Versal™ AI Edge Gen2 Development Kit View Productsverwandt mit iWave Global iG-G77D® Versal™ AI Edge Gen2 Development Kit
Veröffentlichungsdatum: 2026-06-01 | Aktualisiert: 2026-06-02