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Lantronix Open-Q™ 8550CS SiP - Coming Soon

Lantronix Open-Q™ 8550CS System-in-Package (SiP) is based on the Qualcomm® QCS8550 System-on-Chip (SoC). The Open-Q 8550CS offers a premium performance level of 55 TOPs, meeting the higher AI/ML requirements for extreme edge computing, including Edge devices, Edge servers, and Edge AI boxes. These components offer low power consumption with a 4nm process, maximum heterogeneous computing, and an 8th-generation AI engine delivering 10x performance over the previous generation. The Lantronix Open-Q 8550CS SiP features enterprise-level connectivity with Wi-Fi® 7 supporting up to 5.8Gbps and best-in-class performance across compute processing, camera, AI, security, and audio.

The Open-Q 8550CS enhances video conferencing meeting experiences, automated guided vehicle pathing, smart camera image quality, and edge AI box scalability with octal-core computing capabilities and 48 AI TOPS tensor performance. The SiPs perform complex 3D rendering and computer vision tasks with a powerful Adreno 740 GPU supporting ray tracing, Open GL ES, Vulkan, and Open CL profiles.

These devices feature 4K240/8K60 video decoding and 4K120/8K30 encoding. The Open-Q 8550CS can connect edge AI boxes leveraging high-speed 2.5G and 10G Ethernet ports.

Features

  • Processor
    • Qualcomm 8550 SoC built on 4nm technology, Kryo™ octa-core CPU: 1 Prime at 3.2GHz + 4 Gold at 2.8GHz + 3 Silver at 2.0GHz
    • Adreno™ 740 GPU
    • Spectra™ image signal processor
    • Adreno 8550 video processing unit
    • Adreno 1295 display processing unit
    • Dual eNPU V3, 4x HVX, HMX, 48 INT8, 12 FP16 TOPs
    • Secure processing unit
  • 8GB LPDDR5x at 4200MHz and 128GB UFS or 16GB LPDDR5x at 4200MHz and 128GB UFS
  • Wi-Fi 7 802.11be 2×2 MU-MIMO + BLUETOOTH® 5.3 capable
  • Display interfaces
    • Up to four concurrent displays, up to QHD+ at 144Hz on-device display, up to 4K at 60Hz external display
    • Two 4-lane MIPI DSI D-PHY 1.2
    • Supports DisplayPort v1.4 on USB Type-C™ with USB3.2 Gen 2
  • Camera interfaces
    • Eight MIPI CSI D-PHY 1.2 or C-PHY 2.0 camera ports + CCI I2C control
    • Up to five concurrent cameras, 18bpp, 64 + 36 MP30
    • Three 36MP or one 108 MP at 30 fps ZSL, 3IFE + 2 IFE Lite
    • Always-on camera
  • Android™ 13 and Linux Yocto Kirkstone software
  • On-device AI engine up to 55 TOPS
  • Dedicated computer vision engine
  • Video performance
    • Video decode up to 4K240/8K60, native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
    • Video encode up to 4K120/8K30, native encode support for H.265 Main 10, H.265 Main, and H.264 High
    • Concurrent 4K60 Dec and 4K60 Enc
  • Audio
    • Supports WCD938x high fidelity audio codec and WSA884x speaker amp on carrier board
    • Dedicated Hexagon™ audio DSP, SoundWire, MI2S, and DMIC interfaces for audio devices on carrier board
  • High-speed connectivity
    • Two PCIe Gen3 2-lane
    • Supports SGMII and USXGMII interfaces
    • One USB 3.2 Gen 2 with support for Type-C + DisplayPort v1.4
    • One USB 3.2 Gen 1
  • 3.7V nominal operating input voltage
  • -25°C to +85°C operating temperature range
  • Power management and battery charging solution on SOM
  • I/O interfaces - two SDC v 3.0, one SD, UART, I2C, I3C, SPI, configurable GPIOs, sensor I/O to Qualcomm Sensing Hub 3.0
  • 54mm x 45mm x 3.61mm LGA SiP form factor
  • TAA and NDAA compliant
  • 10 years longevity
  • REACH and RoHS-compliant

Applications

  • Multi-camera and smart camera systems
  • Edge AI gateways
  • Video collaboration
  • Video transcoding
  • Retail
  • Cloud gaming
  • Industrial drones
  • Autonomous mobile robots
Veröffentlichungsdatum: 2025-01-14 | Aktualisiert: 2025-01-15