Parker Chomerics CHO-THERM® 1674 1.0W/m-K Conductive Insulator Pads

Parker Chomerics CHO-THERM® 1674 Conductive Insulator Pads feature 1.0W/m·K thermal conductivity, 2.5kV voltage breakdown, 0.41°C-in2/W (2.6°C-cm2/W) thermal impedance. These commercial-grade, silicone and fiberglass thermal pads offer robust mechanical strength and operate in a wide temperature range of -40°C to +200°C. The CHO-THERM 1674 series is offered as dry pads with an optional pressure-sensitive adhesive (PSA) acrylic layer for ease of installation. The pads provide an alternative to greased mica insulators between discrete power devices and heat sinks. Parker Chomerics CHO-THERM 1674 Conductive Insulator Pads come in a standard thickness of 0.010" (0.25mm) with a thickness tolerance of ±0.001" (±0.025mm).

Features

  • Blue color
  • Silicone material
  • Fiberglass-reinforcement carrier
  • Robust mechanical strength
  • Excellent mechanical strength and puncture resistance
  • Available with or without acrylic PSA
  • Good thermal properties
  • Available on continuous rolls for easy peel-and-stick application
  • Wide operating range
  • UL recognized V-0 flammability rating
  • RoHS compliant

Applications

  • Power conversion equipment
  • Power supplies and UPS
  • Power semiconductors
  • Automotive electronics
  • Motor and engine controllers
  • Televisions and consumer electronics

Specifications

  • 0.010" (0.25mm) standard thickness
  • ±0.001" (±0.025mm) thickness tolerance
  • -40°C to +200°C operating temperature range
  • 0.41°C-in2/W (2.6°C-cm2/W) thermal impedance at 300psi (tested without PSA)
  • 1.0W/m·K thermal conductivity
  • 1.0J/g-K heat capacity
  • 300ppm/K coefficient of thermal expansion
  • 2500VAC voltage breakdown (dry)
  • 1014Ω-cm volume resistivity (dry)
  • 1500psi (10.3MPa) tensile strength
  • 100lb/in (17.5kN/m) tear strength
  • 2% elongation
  • 85 Shore A hardness
  • 2.45 specific gravity

Application Example

Infographic - Parker Chomerics CHO-THERM® 1674 1.0W/m-K Conductive Insulator Pads
Veröffentlichungsdatum: 2026-06-08 | Aktualisiert: 2026-06-23