Parker Chomerics THERM-A-GAP™ TC50 5.0W/m-K Thermal Putty
Parker Chomerics THERM-A-GAP™ TC50 5.0W/m-K Thermal Putty is a high-performance, single-component, dispensable thermal compound that conducts heat between a hot component and a heat sink or enclosure. The TC50 compound offers low thermal impedance at multiple gaps, enabling the use of common heat spreaders. The material's heavy paste-like consistency offers controlled dispensing and can be applied in various thicknesses to meet application needs. Parker Chomerics THERM-A-GAP TC50 5.0W/m-K Thermal Putty features a low compressive force to deform under assembly pressure, which means minimal stress to components, solder joints, and leads. The putty is formulated to accommodate modern electronics and is ideal for automated dispensing machines, rework, and field repair situations.
Features
- High-performance, single-component, dispensable thermal compound
- Easily dispensed
- No secondary curing required
- Low thermal impedance
- Ultra-low compression force
- Minimal stress to components, solder joints, and leads
- Reworkable
- Able to accommodate variety of bond-line applications
Applications
- Automotive electronic control units (ECUs)
- Power supplies and semiconductors
- Memory and power modules
- Microprocessors
- Consumer electronics
Specifications
- 10g/min flow rate, 30cc syringe with no tip attachment 0.100" orifice, 90psi (621kPa)
- 3.25 specific gravity
- 0.006" (0.15mm) typical minimum bond-line thickness
- 5.0W/m-K thermal conductivity (bulk)
- 1.0J/g-K heat capacity
- -67°C to +392°C operating temperature range
- 200kVac/8mm dielectric strength
- 1014Ω-cm volume resistivity
- 6.8 dielectric constant at 1000kHz
- 0.022 dissipation factor at 1000kHz
- 0.07% TML (0.01% CVCM) outgassing
Videos
Dispense Patterns
