Texas Instruments TDA4VH/AH-Q1 & TDA4VP/AP-Q1 Jacinto™ Processors

Texas Instruments TDA4VH-Q1, TDA4AH-Q1, TDA4VP-Q1, and TDA4AP-Q1 Jacinto™ Processors are automotive driver-assist SoCs for vision perception, analytics, sensor fusion, and advanced compute applications. The series combines Arm® Cortex®-A72 cores, Arm Cortex-R5F MCUs, C7x DSP resources, deep-learning matrix multiply acceleration, vision processing, depth and motion processing, and GPU options for scalable automotive processing designs.

The TDA4VH-Q1 and TDA4AH-Q1 variants support up to 32TOPS of AI performance, while the TDA4VP-Q1 and TDA4AP-Q1 variants support up to 24TOPS for vision perception and analytics. The TI TDA4VH/AH-Q1 and TDA4VP/AP-Q1 Jacinto Processors also include high-speed connectivity, LPDDR4 memory support, functional safety capabilities, device security, camera interfaces, PCIe, USB, and integrated Ethernet switching for complex automotive systems.

The processors are ideal for automotive driver-assist systems, high-performance computing, multicamera processing, sensor fusion, and ADAS domain-control applications. The TDA4VH/AH-Q1 and TDA4VP/AP-Q1 devices are AEC-Q100 qualified on the Q1 variants and are available in FCBGA packages, supporting -40°C to +125°C operating temperatures.

Features

  • TDA4VH/AH-Q1 and TDA4VP/AP-Q1 AEC-Q100 qualified on Q1 part number variants
  • Functional Safety-Compliant support on select part numbers
    • Documentation available to aid ISO 26262 and IEC 61508 functional safety system designs up to ASIL D and SIL 3
    • ISO 26262 and IEC 61508 certification up to ASIL D and SIL 3 by TÜV SÜD
  • Scalable AI and vision processing
    • TDA4VH-Q1 and TDA4AH-Q1 support up to 32TOPS of AI performance
    • TDA4VP-Q1 and TDA4AP-Q1 support up to 24TOPS of AI performance
  • Processor resources
    • Up to four C7x floating-point vector DSPs
    • Up to four deep-learning matrix multiply accelerators
    • Eight Arm Cortex-A72 microprocessor subsystem
    • Eight Arm Cortex-R5F MCUs
  • Vision, imaging, and analytics acceleration with VPAC, ISP, DMPAC, video encode, and video decode resources
  • Device security on select part numbers
    • Secure boot with secure run-time support
    • Customer-programmable root key up to RSA-4K or ECC-512
    • Embedded hardware security module
    • Crypto hardware accelerators with PKA, ECC, AES, SHA, RNG, DES, and 3DES support
  • High-speed interface support for Ethernet, PCIe, USB 3.0, and MIPI CSI-2 camera connectivity
  • Supported operating systems include AutoSAR, FreeRTOS, INTEGRITY, Linux, QNX, SafeRTOS, VxWorks, and u-velOSity

Applications

  • Vision perception and analytics
  • Automotive driver assist SoCs
  • ADAS/AD automotive camera
  • Front camera
  • Mirror replacement and camera mirror
  • 3D surround view
  • ADAS domain controller
  • Cluster, IVI, and displays
  • Driver monitoring and occupant monitoring

Specifications

  • Memory subsystem
    • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • Up to four External Memory Interface modules with ECC and LPDDR4 support
    • LPDDR4 speeds up to 4266MT/s
    • Up to 4x32-b bus with inline ECC up to 68GB/s
    • 3x512KB on-chip SRAM in MAIN domain with ECC protection
  • Ethernet switch support
    • Up to 8 external ports for TDA4xH devices
    • Up to 4 external ports for TDA4xP devices
    • Two ports with 5Gb and 10Gb USXGMII/XFI support
  • PCIe Gen3 controller support
    • Up to 4x2-L or 2x4L for TDA4xH devices
    • Up to 2x2L or 1x4L for TDA4xP devices
  • USB 3.0 dual-role device subsystem with Enhanced SuperSpeed Gen1 port and Type-C switching support
  • Camera interface support
    • Three CSI2.0 4L Camera Serial Interface RX ports
    • Two CSI2.0 4L TX ports
    • MIPI CSI 1.3 and MIPI-DPHY 1.2 compliance
  • Package and temperature
    • TDA4VH-Q1 FCBGA package with 1414 pins
    • Operating temperature range of -40°C to +125°C

Functional Block Diagram

Block Diagram - Texas Instruments TDA4VH/AH-Q1 & TDA4VP/AP-Q1 Jacinto™ Processors
Veröffentlichungsdatum: 2026-06-29 | Aktualisiert: 2026-06-29