Zurück zu Trenz Electronic

Trenz Electronic TE0720-04-62I33ML SoC Module with AMD Zynq 7020-2I

Trenz Electronic TE0720-04-62I33ML SoC Module is an industrial-grade SoC module integrating an AMD/Xilinx Zynq™ 7020-2I SoC, a Gigabit Ethernet transceiver, 1GByte DDR3 SDRAM, 32MByte Flash memory for configuration and operation, and robust switch-mode power supplies for all on-board voltages. Rugged high-speed stacking strips provide a large number of configurable I/Os. Smaller than a credit card, the 4cm x 5cm form factor modules are fully mechanically and largely electrically compatible and operate in an industrial -40°C to +85°C temperature range.

Features

  • AMD/Xilinx Zynq™ XC7Z020-2CLG484I
  • Speedgrade 2
  • Rugged for high shock and vibration
  • ARM dual-core Cortex-A9 MPCore
  • 10/100/1000 tri-speed Gigabit Ethernet transceiver (PHY), SGMII accessible on a board-to-board connector
  • USB 2.0 high-speed ULPI transceiver
  • 1GByte (32-bit) DDR3 SDRAM
  • 32MByte QSPI Flash memory (for configuration and operation)
  • 8GByte e.MMC (up to 32GByte)
  • Plug-on module with 2x 100-pin and 1x 60-pin Razor Beam high-speed hermaphroditic terminal/socket strips (low profile, 2.5mm)
  • 152x FPGA I/Os (75x LVDS pairs possible) and 14x MIOs available on board-to-board connectors
  • Onboard high-efficiency DC-DC converters
    • 4.0A x 1.0V power rail
    • 3.0A x 1.5V power rail
    • 3.0A x 1.8V power rail
  • System management and power sequencing
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Valid MAC address and 2K serial EEPROM
  • RTC, temperature compensated
  • 3x user LEDs
  • Evenly spread supply pins for good signal integrity
  • 4cm x 5cm form factor

Specifications

  • 2.5V to 5.5V operating VIN supply voltage range
  • 1.71V to 3.465V supply voltage range for the PS MIO banks
  • 1.14V to 3.465V supply voltage range for HR I/O banks
  • Operating temperature ranges
    • 0°C to +70°C commercial grade
    • -40°C to +85°C industrial and automotive grade
  • 8mm mating height with standard connectors
  • 1.6mm PCB thickness
  • Highest part on the PCB is approximately 2.5mm

Block Diagram

Block Diagram - Trenz Electronic TE0720-04-62I33ML SoC Module with AMD Zynq 7020-2I

Related Products

AMD / Xilinx Zynq®-7000 SoC-Architektur der ersten Generation

Eine flexible Plattform zur Einführung neuer Lösungen, die gleichzeitig eine vollständig programmierbare Alternative bietet.

Learn Moreüber AMD / Xilinx Zynq®-7000 SoC-Architektur der ersten Generation View Productsverwandt mit AMD / Xilinx Zynq®-7000 SoC-Architektur der ersten Generation

Samtec Razor Beam™ LSHM Steckverbinder

Verfügt über ein selbststeckendes System zur Reduzierung der Lagerkosten, ist ummantelt und bietet bis zu 100 I/Os.

Learn Moreüber Samtec Razor Beam™ LSHM Steckverbinder View Productsverwandt mit Samtec Razor Beam™ LSHM Steckverbinder

Trenz Electronic TE0720-04-62I33MA System-on-Chip (SoC) Module

Integrates an AMD/Xilinx Zynq™ 7020-2I SoC, a Gigabit Ethernet transceiver, and 1GByte DDR3 SDRAM.

Learn Moreüber Trenz Electronic TE0720-04-62I33MA System-on-Chip (SoC) Module View Productsverwandt mit Trenz Electronic TE0720-04-62I33MA System-on-Chip (SoC) Module
Veröffentlichungsdatum: 2024-05-28 | Aktualisiert: 2025-02-13