Multiprotokoll-Module

Ergebnisse: 244
Auswählen Bild Teile-Nr.
 Herst.
Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern.
Menge RoHS ECAD Model Serie
Frequenz
Ausgangsleistung
Schnittstellen-Typ
Versorgungsspannung - Min.
Versorgungsspannung - Max.
Minimale Betriebstemperatur
Maximale Betriebstemperatur
Antennenanschlusstyp
Abmessungen
Protokoll – Bluetooth, BLE – 802.15.1
Protokoll – Mobilfunk, NBIoT, LTE
Protokoll – GPS, GLONASS
Protokoll – Sub-GHz
Protokoll – WLAN – 802.11
Protokoll – ANT, Thread, Zigbee – 802.15.4
Produkt
Verpackung
Embedded Artists Multiprotokoll-Module 2LL M.2 Module
Datenblatt
5Auf Lager
23erwartet ab 19.10.2026
Min.: 1
Mult.: 1

UART 3.3 V 3.46 V - 40 C + 85 C U.FL Bluetooth WiFi Modules Bulk
Microchip Technology Multiprotokoll-Module Bluetooth Low Energy/15.4 Combo Module with PCB Antenna and extended temperature
Datenblatt
72Auf Lager
72erwartet ab 24.09.2026
Min.: 1
Mult.: 1

2.4 GHz 12 dBm 1.9 V 3.6 V - 40 C + 125 C 7 mm x 7 mm x 0.9 mm Bluetooth Zigbee Bluetooth and Zigbee Modules Tray
u-blox Multiprotokoll-Module M.2 card with MAYA-W161, in tray
Datenblatt
237Auf Lager
Min.: 1
Mult.: 1

MAYA-W1 2.4 GHz, 5 GHz 18 dBm I2S, PCIe, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 2.8 mm BLE, Bluetooth 5.2 802.11 a/b/g/n Tray

Silicon Labs Multiprotokoll-Module Wireless bluetooth SiP module, Secure Boot with Root of Trust and Secure Loader(RTSL), 78 MHz, 10 dBm
Datenblatt
1’300Auf Lager
Min.: 1
Mult.: 1

xGM240S 2.4 GHz 10 dBm I2C, USART 1.8 V 3.8 V - 40 C + 105 C Built-In, RF 7 mm x 7 mm x 1.18 mm Bluetooth 5.3 802.15.4 (ANT, Thread, Zigbee) Tray
Ezurio Multiprotokoll-Module 60 Series, Sterling Module w/u.FL, PCIE/USB
Datenblatt
818Auf Lager
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm UART, USB 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Microchip Technology Multiprotokoll-Module ATWILC3000 802.11 b/g/n + Bluetooth 5 Module Chip Antenna
Datenblatt
2’220Auf Lager
Min.: 1
Mult.: 1

2.4 GHz 18.5 dBm SDIO, SPI, UART 1.62 V 3.6 V - 40 C + 85 C Chip 22.4 mm x 14.7 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
u-blox Multiprotokoll-Module M.2 card with JODY-W263, in tray
Datenblatt
195Auf Lager
Min.: 1
Mult.: 1

JODY-W2 2.4 GHz, 5 GHz 18 dBm GPIO, SDIO, UART 1.8 V 3.3 V - 40 C + 85 C u.FL 22 mm x 30 mm x 4.2 mm Bluetooth 5.2 Tray
Inventek Multiprotokoll-Module 802.11a/b/g/n serial-to-WiFi and BT 4.0 combo module with integrated TCP/IP stack. 2.4 and 5 GHz Chip Antenna. 2MB External Flash. Inventek AT Commands (IWIN) firmware and Cypress WICED compatible. Certified FCC/IC/CE
Datenblatt
213Auf Lager
Min.: 1
Mult.: 1

ISM43340 2.4 GHz, 5 GHz 19 dBm SPI, UART 3.3 V 3.3 V - 40 C + 85 C Chip 14.5 mm x 34 mm x 2.5 mm Bluetooth 802.11 a/b/g/n Tray

Espressif Systems Multiprotokoll-Module SMD module, ESP32-D0WD-V3, ESP32 ECO V3, 4 MB SPI flash, IPEX antenna connector, -40 C +105 C
Datenblatt
1’649Auf Lager
7’150Auf Bestellung
Min.: 1
Mult.: 1

2.4 GHz 19.5 dBm I2C, I2S, PWM, SDIO, SPI, UART 3 V 3.6 V - 40 C + 105 C External 18 mm x 19 mm x 3.2 mm BLE, Bluetooth 4.2 802.11 b/g/n Tray
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R8 with 8 MB Octal PSRAM die inside, 4 MB Quad SPI flash, PCB antenna
Datenblatt
3’640Auf Lager
1’950erwartet ab 26.10.2026
Min.: 1
Mult.: 1

2.4 GHz 20.5 dBm I2C, I2S, SPI, PWM, UART, USB 3 V 3.6 V - 40 C + 65 C PCB 25.5 mm x 18 mm x 3.1 mm Bluetooth 5.0 802.11 b/g/n Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-U4WDH with 4 MB flash die inside, ESP32 ECO V3, IPEX connector
Datenblatt
1’002Auf Lager
Min.: 1
Mult.: 1
2.4 GHz 19.5 dBm I2C, I2S, SDIO, SPI, PWM, UART 3 V 3.6 V - 40 C + 85 C PCB 13.2 mm x 19 mm x 2.4 mm Bluetooth 4.2 Tray
Microchip Technology Multiprotokoll-Module ATWINC3400 802.11 b/g/n + Bluetooth 5 Module U.FL Antenna
Datenblatt
809Auf Lager
Min.: 1
Mult.: 1
2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C u.FL 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 Tray
Ezurio Multiprotokoll-Module Module, Sterling LWB5+, M.2, Key E, SDIO, UART
Datenblatt
188Auf Lager
Min.: 1
Mult.: 1

Sterling-LWB5+ 2.4 GHz, 5 GHz Serial, SDIO 3.3 V 3.3 V - 40 C + 85 C External 12 mm x 17 mm x 2.2 mm Bluetooth 5.2, Bluetooth LE WiFi 5, 802.11 ac Tray
Ezurio Multiprotokoll-Module 60 Series, Sterling Module w/u.FL, PCIE/UART
Datenblatt
194Auf Lager
Min.: 1
Mult.: 1

60-2230C 2.4 GHz, 5 GHz 18 dBm SDIO, UART 2.97 V 3.63 V - 40 C + 85 C u.FL 22 mm x 30 mm x 3.3 mm Bluetooth 5.1 802.11 a/b/g/n/ac Adapters Tray
Embedded Artists Multiprotokoll-Module 1YM M.2 Wi-Fi 5 a/b/g/n/ac MU-MIMO, Bluetooth 5.2 with 88W8997 and LBEE5XV1YM
Datenblatt
51Auf Lager
Min.: 1
Mult.: 1

2.4 GHz, 5 GHz 4-Wire UART, PCIe 3 V 3.6 V - 30 C + 85 C u.FL 22 mm x 30 mm Bluetooth 5.2 802.11 a/b/g/n/ac WiFi Modules Bulk
Espressif Systems Multiprotokoll-Module SMD module, ESP32-S3R2 with 2 MB PSRAM die inside, 4 MB SPI flash, IPEX antenna connector.
Datenblatt
Weitere Infos Verfügbar

2.4 GHz 20.5 dBm GPIO, I2C, I2S, SPI, UART 3 V 3.6 V - 40 C + 85 C PCB 19.2 mm x 18 mm x 3.2 mm Bluetooth 5.0 802.11 b/g/n Bulk
Microchip Technology Multiprotokoll-Module SMARTCONNECT WINC3400 WL MOD
Datenblatt
767Auf Lager
Min.: 1
Mult.: 1

ATWINC3400 2.4 GHz 18.3 dBm I2C, SPI, UART 2.7 V 3.6 V - 40 C + 85 C Chip 22.43 mm x 14.73 mm x 2 mm Bluetooth 5.0 802.11 b/g/n Tray
Silex Technology Multiprotokoll-Module [Sample Pack] The SX-SDMAX-M2 is an M.2 2230 card that implements the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It features an MHF-I connector as an interface fo
Datenblatt
5Auf Lager
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 22 mm x 4.45 mm x 30 mm SDIO Modules Bulk
Pulse Electronics Multiprotokoll-Module USB 802.11 b/g/n BT module
736Auf Lager
Min.: 1
Mult.: 1

TWR 2.4 GHz 14 dBm, 16 dBm USB 2.0 3 V 3.6 V - 5 C + 60 C 14.7 mm x 10.8 mm x 3.2 mm BLE, Bluetooth 802.11 b/g/n Tray
Silex Technology Multiprotokoll-Module [Sample Pack] SX-SDMAX-2530C is a board-to-board connector type board implementing the SX-SDMAX-2530S. It is a 2.4 GHz/5 GHz dual-band Wi-Fi 6 plus Bluetooth v5.3 BR/EDR/LE SDIO 3.0 module using the NXP IW611 chipset.It includes an MHF-I connector f
Datenblatt
10Auf Lager
Min.: 1
Mult.: 1

SX-SDMAX 2.4 GHz/5 GHz Bluetooth, WiFi, UART 3.14 V 3.46 V - 40 C + 85 C 24 mm x 24 mm x 4.45 mm SDIO Modules Bulk
Silex Technology Multiprotokoll-Module [Sample Pack] SX-PCEAX-SMT-SP is a sample pack SKU ideal for small quantities used for small pilot builds. SX-PCEAX-SMT-SP is a 2.4 GHz/5 GHz /6 GHz Tri-band IEEE802.11 ax WLAN, Bluetooth 5.2 BR/EDR/HS/LE module in an M.2 LGA Type 1418 Surface Mount
Datenblatt
651Auf Lager
Min.: 1
Mult.: 1

SX-PCEAX 2.4 GHz, 5 GHz, 6 GHz PCIe, USB 3.135 V 3.465 V - 20 C + 65 C MHF4 14 mm x 18 mm x 1.9 mm Bluetooth 5.2 802.11 a/b/g/n/ac/ax Bulk
Silicon Labs Multiprotokoll-Module MGM13S02F512GN Mighty Gecko SiP Module for Zigbee and Thread 802.15.4 Mesh and Multiprotocol Connectivity
Datenblatt
260Auf Lager
Min.: 1
Mult.: 1

MGM13S 2.4 GHz 10 dBm I2C, SPI, UART 1.8 V 3.8 V - 40 C + 85 C RF 6.5 mm x 6.5 mm x 1.4 mm Bluetooth Thread, Zigbee Mesh SiP Modules Tray
Telit Cinterion Multiprotokoll-Module 143Auf Lager
392Auf Bestellung
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
Telit Cinterion Multiprotokoll-Module 392Auf Lager
Min.: 1
Mult.: 1

1.4 MHz 23 dBm I2C, SPI, UART 2.2 V 4.5 V - 40 C + 85 C 18 mm x 15 mm Cellular, NBIoT, LTE GPS Multiprotocol Module Tray
InnoPhase IoT Multiprotokoll-Module WiFi/BLE5/MCU Module w/ PCB Antenna
Datenblatt
385Auf Lager
Min.: 1
Mult.: 1
2.4 GHz 17.5 dBm SPI, UART 2.6 V 3.6 V - 40 C + 85 C PCB 12.8 mm x 20 mm x 2.5 mm BLE 5.0 802.11 b/g/n 802.11 b/g/n, BLE 5.0 Tray