Waffle Passive Bauteile

Signalaufbereitung The MBAL-0250CSP2 is a GaAs passive MMIC 1:2 balun that features excellent 35 dB common mode rejection over a 2 to 50 GHz operational bandwidth.

Signalaufbereitung The MPD-0422SCSP2 is a small footprint MMIC 4-22 GHz 2-Way power divider/power splitter featuring high 22 dB isolation and low 0.9 dB insertion loss in our compact CSP2 chip scale package.

Signalaufbereitung The MBAL-0220CSP2 is a GaAs passive MMIC balun featuring a frequency range of 2 to 20 GHz. This balun offers low 1.9 dB insertion loss as a mode converter, excellent balance and 27 dB common mode rejection in a compact 2.5 mm CSP2 chip scale package.

Spezial-Keramikkondensatoren 100Volts 820pF 20% S ingle Layer Cap

Signalaufbereitung The MPDR-0070CSP2 is a small footprint mmWave MMIC DC-70 GHz 2-Way resistive power divider/power splitter featuring low 1.5 dB insertion loss in our compact CSP2 chip scale package. It is much smaller than a printed PCB Power Divider/Combiner.

Signalaufbereitung MPD-0226SM is a MMIC 2-way Wilkinson power divider. Passive GaAs MMIC technology allows production of smaller constructions that replace larger form factor circuit board constructions. The MPD-0226SM is available as a 4 X 4 mm QFN package.

Antennen GNSS (GPS/Glonass/Be iDou/Galileo) 76mm C

Dickfilmwiderstände - SMD CHP 0603 100PPM 1K 1% B TR

Spezial-Keramikkondensatoren AVX/ATC SLC FINISHED

Signalaufbereitung 950MHz Size 3116

Signalaufbereitung X-Band100WLimiter,QFN

Keramik-Vielschichtkondensator MLCC – bedrahtet 2000VDC 0.018uF C0G 10% LS=6.35mm