Parker Chomerics THERM-A-GAP® CIP 35 2.5W/m-K Thermal Compound
Parker Chomerics THERM-A-GAP® Cure-in-Place (CIP) 35 Thermal Compound is a two-component dispensable compound with a 2.5W/m-K thermal conductivity. The CIP 35 compound features 55 Shore A hardness and cools electronics without excessive compressive force in sensitive cooling applications. This versatile liquid can be dispensed by hand or robotically and cured into complex geometries to cool multi-height components on a printed circuit board (PCB) without a molded sheet. The series is available in ready-to-use cartridge systems that eliminate the need for weighing, mixing, and degassing. Parker Chomerics THERM-A-GAP CIP 35 Thermal Compound offers a long shelf life with no settling or degradation of the cure.
Features
- Dispensable cure-in-place gap filling, potting, sealing, and encapsulating
- Excellent blend of high thermal conductivity, flexibility, and ease of use
- Conformable to irregular shapes without excessive force on components
- Ready-to-use cartridge system eliminates weighing, mixing, and degassing steps
- Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, SEMCO® tubes, and pneumatic applicators)
- Vibration dampening
- 55 Shore A hardness
- Long shelf life, no settling or degradation of cure
- Sag resistant, maintains shape during cure
Applications
- Automotive E-mobility (converters and inverters)
- Automotive infotainment (displays, HUD, and audio)
- Automotive ADAS (DCU, cameras, and radar/LiDAR)
- Energy storage (residential, commercial, and grid-level)
- Power electronics
- Telecommunications infrastructure
Typical Applicator
Dispense Patterns
Related Compounds
Parker Chomerics THERM-A-GAP® Conductive, Cure-In-Place Compound
Two-component compounds that conform to irregular shapes and are vibration-dampening.