Parker Chomerics THERM-A-GAP® Conductive, Cure-In-Place Compound
Parker Chomerics THERM-A-GAP® Conductive, Cure-in-Place (CIP) Compounds are two-component compounds that conform to irregular shapes and are vibration-dampening. No pre-mixing or weighing of components is required when using CIP 35 and CIP 60 compounds. The CIP 35 series features dispensable cure-in-place gap filling, potting, sealing, and encapsulating with a 55 Shore A hardness. The CIP 60 compound offers excellent thermal performance with 6.0W/m-K typical thermal conductivity and 50 Shore 00 hardness at full cure. Parker Chomerics THERM-A-GAP Conductive CIP Compounds are ideal for automotive, energy storage, power electronics, and telecommunications infrastructure applications.
Features
- Both types
- Two-component compound
- Conformable to irregular shapes
- No pre-mixing or weighing of components required
- Vibration dampening
- CIP 35
- Dispensable cure-in-place gap filling, potting, sealing, and encapsulating
- Long shelf life, no settling or degradation of cure
- 55 Shore A hardness
- CIP 60
- Excellent thermal performance
- 6.0W/m-K typical thermal conductivity
- Ultra-low out-gassing performance for minimal vapor contamination
- 50 Shore 00 hardness (at full cure)
Applications
- Automotive E-mobility (converters and inverters)
- Automotive infotainment (displays, HUD, and audio)
- Automotive ADAS (DCU, cameras, and radar/LiDAR)
- Energy storage (residential, commercial, and grid-level)
- Power electronics
- Telecommunications infrastructure
Performance Guide
Typical Applicator
Dispense Patterns
Datasheets
Featured Compounds
Parker Chomerics THERM-A-GAP® CIP 35 2.5W/m-K Thermal Compound
Two-component dispensable compound with a 2.5W/m-K thermal conductivity.