Parker Chomerics THERM-A-GREASE 30 3.0W/m-K High Reliability Grease

Parker Chomerics THERM-A-GREASE 30 3.0W/m-K High Reliability Grease features a thin bond line and efficiently dissipates heat in electronic components. This high-performance grease features silicone-based, single-component materials to ensure high reliability, while the minimum bond line of 0.001" (0.025 mm) is ideal for applications with stringent manufacturing and assembly tolerances. The grease operates effectively under low pressure, making it well-suited for heat transfer in delicate or densely packed PCB components. Parker Chomerics THERM-A-GREASE 30 3.0W/m-K High Reliability Grease withstands thermal cycling, long-term heat aging, and high-humidity conditions, providing stability without pumping out, hardening, or cracking in extreme environments. The grease can be stenciled, screen-printed, or dispensed and does not require mixing, curing, or refrigeration.

Features

  • Thin bondline
  • Silicone-based, single-component materials
  • Requires low compression force
  • Can be stenciled, screen-printed, or dispensed
  • High reliability
  • Easy to dispense
  • Requires no curing, mixing, or refrigeration

Applications

  • CPUs and GPUs
  • Memory modules
  • Power supplies
  • Power conversion equipment
  • Lighting
  • Automotive control modules and electronics

Specifications

  • 0.001" (0.025mm) bond line
  • 3.0W/m-K thermal conductivity
  • 12-month shelf life
  • Thermal impedance of 0.015°C-in2/W at 40psi and 0.013°C-in2/W at 100psi at minimum bond line

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Veröffentlichungsdatum: 2026-06-08 | Aktualisiert: 2026-06-19