congatec Embedded Lösungen

Computer-On-Module - COM COM-HPC Mini module based on Intel Core i7-1365URE processor with 2 P-cores 1.7GHz up to 4.9GHz Turbo and 8 E-cores 1.2GHz up to 3.7GHz Turbo 12MB Intel Smart Cache Intel Iris Xe Graphics architecture with 96 EUs 32GB onboard LPDDR5x memor

Computer-On-Module - COM Qseven module with Intel Atom E3845 quad core processor with 1.91GHz, 2MB L2 cache, 4GB 1333MT/s DDR3L onboard dual channel memory. No onboard eMMC.

Entwicklungsplatinen & -kits - x86 EVALUATION CARRIER BRD COM EXP TYPE 10

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Celeron 3955U dual core processor with 2.0GHz, 2MB L2 cache, 2133MT/s dual channel DDR4 memory interface

Entwicklungsplatinen & -kits - x86 3.5 Carrier Board for SMARC 2.0 modules with x86 CPUDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Entwicklungsboards und Kits - ARM 3.5 Carrier Board for SMARC 2.0 modules with ARMDimensions are 146mm x 102 mm (5.74" x 4.02")Operating Temperature: 0 C to 60 C (commercial)

Computer-On-Module - COM COM Express Type 6 Basic module based on AMD embedded R-Series R1606G 2-core processor with 2.6 GHz up to 3.5 GHz turbo boost, 1MB L2 Cache and dual channel DDR4 2400MT/s memory interface (formerly Great Horned Owl). Features AMD Radeon Vega integr

Entwicklungsplatinen & -kits - x86 COMe Eval Carrier T7

Computer-On-Module - COM Q7 INTEL ATOM E3845 BAY TRAIL COM TEMP

Computer-On-Module - COM JUMPtec SMARC-sAMX6i 4x0.8 1/4GB

Computer-On-Module - COM COM Express Type 6 Compact module with Intel Core i7-7600U dual core processor with 2.8GHz up to 3.9GHz, 4MB Intel Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Kaby Lake-U).

Computer-On-Module - COM JUMPtec COMe-mBTi10 E3815 1E/2S