Parker Chomerics Featured Products

Features a thin bond line and efficiently dissipates heat in electronic components.

Dispensable compound that conducts heat between a hot component and a heat sink or enclosure.

Solution for applications that require a moderate thermal performance in electronic device designs.

No mixing or curing for superior design flexibility and meets Telcordia silicone standards.

Two-component dispensable compound with a 2.5W/m-K thermal conductivity.

Features true multiplanar, Z-axis electrically conductive foam for indoor applications.

1W/m·K thermal conductivity, 2.5kV voltage breakdown, 0.41°C-in²/W (2.6°C-cm²/W) thermal impedance.

Offers Ni/Al particles for superior shielding performance and durable mechanical/chemical stability.

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